ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD
    2.
    发明申请
    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD 审中-公开
    包括电路板的电子设备

    公开(公告)号:US20160242289A1

    公开(公告)日:2016-08-18

    申请号:US15016945

    申请日:2016-02-05

    Abstract: An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.

    Abstract translation: 一种电子设备,包括布置在前盖和后盖之间的电路板,并且包括插入到电路板中的导电图案。 信号产生或电源元件与导电图案电连接。 当从电路板上方观察时,粘合层附着在电路板上并与导电图案的至少一部分重叠。 当从电路板上方观察时,第一结构布置在粘合层上并与粘合层的至少一部分重叠。 第二结构设置在第一结构的顶部,当从电路板上方观察时,与第一结构的至少一部分重叠,并且第二结构包括包括金属的底表面。 金属层插入在第一结构和第二结构的底表面之间,以将第二结构附接到第一结构。

    SUBSTRATE COMPRISING PLURALITY OF SIGNAL LINES AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20200037439A1

    公开(公告)日:2020-01-30

    申请号:US16491350

    申请日:2018-02-13

    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than 4th generation (4G) communication systems such as long term evolution (LTE). In a wireless communication system, a transmission apparatus comprises at least one antenna port for transmitting/receiving a signal, an analogue filter for selecting the frequency of the signal, and a voltage standing wave ratio (VSWR) detection unit for measuring the VSWR of the antenna port, wherein the VSWR detection unit is configured to detect both a forward signal and a reverse signal for an input terminal of the analogue filter, to determine the respective power values of a forward signal and a reverse signal for an output terminal of the analogue filter by applying characteristic parameters of the analogue filter to the detected forward signal and reverse signal, and to determine the VSWR of the antenna port on the basis of the respective power values of the forward signal and the reverse signal for the output terminal of the analogue filter.

    ELECTRONIC DEVICE AND METHOD FOR GENERATING CLOCK SIGNAL FOR IMAGE SENSOR IN CAMERA MODULE

    公开(公告)号:US20190158722A1

    公开(公告)日:2019-05-23

    申请号:US16193220

    申请日:2018-11-16

    Abstract: Disclosed are an electronic device and a method for generating a clock signal within a camera module. The electronic device includes a processor, and a camera module, wherein the camera module may include a clock generation circuit configured to generate a second clock signal, the second clock signal being independent from a first clock signal, the first clock signal being generated by the processor, an optical correction circuit configured to be driven based on the second clock signal, and an image sensor configured to be driven while being synchronized with the optical correction circuit based on the second clock signal, wherein the processor may be configured to transfer a control command to the camera module, based on an input for driving the camera module and to acquire at least one image through the synchronized optical correction circuit and image sensor based on the second clock signal.

    ELECTRONIC DEVICE INCLUDING STRUCTURE FOR STACKING SUBSTRATES

    公开(公告)号:US20210212209A1

    公开(公告)日:2021-07-08

    申请号:US17139365

    申请日:2020-12-31

    Abstract: An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

    IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE IMAGE SENSOR

    公开(公告)号:US20210014387A1

    公开(公告)日:2021-01-14

    申请号:US16923653

    申请日:2020-07-08

    Abstract: An electronic device is provided. The electronic device includes a first image sensor, a second image sensor electrically connected to the first image sensor, and a processor operatively connected to the first image sensor and the second image sensor. The processor may be configured to generate first image data using the first image sensor and generate second image data using the second image sensor based on a synchronizing signal, transmit the second image data generated by the second image sensor to the first image sensor, and control the first image sensor to generate and output image data by processing the first image data and the second image data based on the synchronizing signal.

    PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20210251083A1

    公开(公告)日:2021-08-12

    申请号:US17172338

    申请日:2021-02-10

    Abstract: An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

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