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公开(公告)号:US20210311104A1
公开(公告)日:2021-10-07
申请号:US17061380
申请日:2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junghyun Roh , Minjae Lee , Unho Cha
IPC: G01R31/26 , H01L23/552 , H01L23/522 , H01L23/528 , H01L23/50
Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop passing through the left-bottom corner region, a second conduction loop passing through the right-bottom corner region, a third conduction loop passing through the left-bottom corner region and the left-upper corner region, a fourth conduction loop passing through the right-bottom corner region and the right-upper corner region, and a shielding loop to shield electrical interference between the first through fourth conduction loops. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
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12.
公开(公告)号:US12224759B2
公开(公告)日:2025-02-11
申请号:US17863167
申请日:2022-07-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaerin Lee , Yang Azevedo Tavares , Minjae Lee , Kyeongkeun Kang
Abstract: An apparatus and a method of correcting a mismatch of a time-interleaved analog-to-digital converter are provided. The apparatus may include: a time-interleaved analog-to-digital converter configured to receive a non-return-to-zero (NRZ) signal in a correction mode and generate a first output signal, and including a plurality of analog-to-digital converters; and a mismatch corrector configured to generate a second output signal by processing the first output signal of the time-interleaved analog-to-digital converter based on parameters, wherein the parameters may be generated based on the first output signal of the time-interleaved analog-to-digital converter in the correction mode, and a period of the NRZ signal may be different from a product of a sampling period of the time-interleaved analog-to-digital converter and a number of the plurality of analog-to-digital converters included in the time-interleaved analog-to-digital converter.
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公开(公告)号:US11796587B2
公开(公告)日:2023-10-24
申请号:US17061380
申请日:2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junghyun Roh , Minjae Lee , Unho Cha
IPC: G01R31/26 , H01L23/50 , H01L23/552 , H01L23/528 , H01L23/522
CPC classification number: G01R31/2607 , H01L23/50 , H01L23/5226 , H01L23/5283 , H01L23/552
Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop passing through the left-bottom corner region, a second conduction loop passing through the right-bottom corner region, a third conduction loop passing through the left-bottom corner region and the left-upper corner region, a fourth conduction loop passing through the right-bottom corner region and the right-upper corner region, and a shielding loop to shield electrical interference between the first through fourth conduction loops. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
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