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公开(公告)号:US20210110748A1
公开(公告)日:2021-04-15
申请号:US17070581
申请日:2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byungchul KIM , Doyoung KWAG , Sangmoo PARK , Minsub OH
Abstract: A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.
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公开(公告)号:US20210057258A1
公开(公告)日:2021-02-25
申请号:US16929311
申请日:2020-07-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Doyoung KWAG , Byungchul KIM , Sangmoo PARK , Minsub OH
IPC: H01L21/683 , H01L21/67 , H01L25/075 , H01L27/12 , H01L33/62 , B23K26/08 , B23K26/04 , B23K26/03
Abstract: The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.
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公开(公告)号:US20200243358A1
公开(公告)日:2020-07-30
申请号:US16731468
申请日:2019-12-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung KWAG , Eunhye KIM , Sangmoo PARK , Minsub OH , Yoonsuk LEE
IPC: H01L21/67 , H01L33/62 , H01L25/075 , H01L21/683
Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.
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