公开(公告)号：US11705386B2

公开(公告)日：2023-07-18

申请号：US17651456

申请日：2022-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang Wuk Park ,  Sung Dong Cho ,  Eun Ji Kim ,  Hak Seung Lee ,  Dae Suk Lee ,  Dong Chan Lim ,  Sang Jun Park

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H01L23/481 ,  H01L21/4814

Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.

公开(公告)号：US10398260B2

公开(公告)日：2019-09-03

申请号：US15260581

申请日：2016-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Jun Park ,  Boo Keun Yoon ,  Han Jun Sung

IPC: H05B1/02 ,  A47J37/06 ,  F21V23/04 ,  H04N5/225 ,  F24C7/08 ,  F24C15/02 ,  G01J1/42 ,  F24C15/04 ,  F21W131/307

Abstract: Disclosed herein is an oven. The oven includes a case having a cooking chamber therein, a door unit connected to the case, configured to open or close the cooking chamber, and having a transparent portion configured to enable a user to see the inside of the cooking chamber, a handle protruding from the door unit to the outside, and a camera module configured to photograph the inside of the cooking chamber, and disposed to be biased toward one end of the handle from the center in longitudinal direction of the handle.