公开(公告)号：US20230195167A1

公开(公告)日：2023-06-22

申请号：US18083322

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeran JUNG ,  Seunghoon KANG ,  Hongki MOON ,  Jongkil PARK ,  Seungjoo LEE

IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/1624 ,  G06F1/1652 ,  G06F1/20 ,  H05K7/20963

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing.

公开(公告)号：US20230050735A1

公开(公告)日：2023-02-16

申请号：US17884995

申请日：2022-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gunhyuk YOON ,  Chanhee PARK ,  Youngsan KIM ,  Seungjoo LEE ,  Seungchul CHOI

IPC: G06F1/20 ,  H04R29/00 ,  G05B13/02 ,  H04R3/00

Abstract: Provided is an electronic device for controlling surface heart and a method of controlling the electronic device. The electronic device includes a speaker, a temperature sensor, a memory, and a processor electrically coupled to the speaker, the temperature sensor, and the memory. The processor obtains first temperature information based on impedance information measured in a coil included in the speaker; obtains second temperature information measured by the temperature sensor, the second temperature information based on a heat source disposed adjacent to the speaker; predicts a surface temperature of a surface area of the electronic device, opposite to an internal area in which the speaker is disposed, based on the first temperature information and the second temperature information using a nonlinear approximation function; and controls an audio signal input to the speaker based on the predicted surface temperature.

公开(公告)号：US20210392736A1

公开(公告)日：2021-12-16

申请号：US17286007

申请日：2019-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha KOO ,  Hongki MOON ,  Chihwan JEONG ,  Kuntak KIM ,  Yunjeong PARK ,  Seungjoo LEE ,  Haejin LEE ,  Seyoung JANG

IPC: H05K1/02 ,  H05K1/14

Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

公开(公告)号：US20210373625A1

公开(公告)日：2021-12-02

申请号：US15734060

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungha KOO ,  Kuntak KIM ,  Hajoong YUN ,  Seungjoo LEE ,  Seyoung JANG ,  Hyuntae JANG

IPC: G06F1/20 ,  G05B15/02 ,  G06F9/50 ,  G05D23/19

Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.