公开(公告)号：USRE49375E1

公开(公告)日：2023-01-17

申请号：US17129109

申请日：2020-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myeong-cheol Kim ,  Cheol Kim ,  Jaehun Seo ,  YooJung Lee ,  Kisoo Chang ,  Siyoung Choi

IPC: H01L29/78 ,  H01L29/66

Abstract: Field effect transistors including a source region and a drain region on a substrate, a fin base protruding from a top surface of the substrate, a plurality of fin portions extending upward from the fin base and connecting the source region with the drain region, a gate electrode on the fin portions, and a gate dielectric between the fin portions and the gate electrode may be provided. A top surface of the substrate may include a plurality of grooves (e.g., a plurality of convex portions and a plurality of concave portions). Further, a device isolation layer may be provided to expose upper portions of the plurality of fin portions and to cover top surfaces of the plurality of grooves.

公开(公告)号：US11387249B2

公开(公告)日：2022-07-12

申请号：US16708482

申请日：2019-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soodoo Chae ,  Myoungbum Lee ,  HuiChang Moon ,  Hansoo Kim ,  JinGyun Kim ,  Kihyun Kim ,  Siyoung Choi ,  Hoosung Cho

IPC: H01L27/11582 ,  H01L27/11578 ,  H01L27/11575 ,  H01L23/498 ,  H01L23/535 ,  H01L29/40 ,  H01L29/423 ,  H01L23/522 ,  H01L27/11565

Abstract: A three-dimensional nonvolatile memory device and a method for fabricating the same include a semiconductor substrate, a plurality of active pillars, a plurality of gate electrodes, and a plurality of supporters. The semiconductor substrate includes a memory cell region and a contact region. The active pillars extend in the memory cell region perpendicularly to the semiconductor substrate. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate. The supporters extend in the contact region perpendicularly to the semiconductor substrate to penetrate at least one or more of the gate electrodes.

公开(公告)号：US20220359566A1

公开(公告)日：2022-11-10

申请号：US17870037

申请日：2022-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soodoo Chae ,  Myoungbum Lee ,  HuiChang Moon ,  Hansoo Kim ,  JinGyun Kim ,  Kihyun Kim ,  Siyoung Choi ,  Hoosung Cho

IPC: H01L27/11582 ,  H01L27/11578 ,  H01L27/11575 ,  H01L23/498 ,  H01L23/535 ,  H01L29/40 ,  H01L29/423 ,  H01L23/522 ,  H01L27/11565

Abstract: A three-dimensional nonvolatile memory device and a method for fabricating the same include a semiconductor substrate, a plurality of active pillars, a plurality of gate electrodes, and a plurality of supporters. The semiconductor substrate includes a memory cell region and a contact region. The active pillars extend in the memory cell region perpendicularly to the semiconductor substrate. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate. The supporters extend in the contact region perpendicularly to the semiconductor substrate to penetrate at least one or more of the gate electrodes.