公开(公告)号：US06825556B2

公开(公告)日：2004-11-30

申请号：US10271003

申请日：2002-10-15

申请人： Mukul A. Joshi ,  Mohan R. Nagar ,  Sarathy Rajagopalan

发明人： Mukul A. Joshi ,  Mohan R. Nagar ,  Sarathy Rajagopalan

IPC分类号： H05K334

CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.

摘要翻译： 一种封装集成电路，包括具有用于接收集成电路的电触点的封装基板。 集成电路电连接到封装衬底的电触头。 加强件安装到封装基板上，其中加强件具有非正交切口，集成电路设置在其中。 切口的边缘设置在与集成电路的侧面不同于集成电路的角落的距离以上。

公开(公告)号：US06320127B1

公开(公告)日：2001-11-20

申请号：US09465425

申请日：1999-12-20

申请人： Kumar Nagarajan ,  Sarathy Rajagopalan

发明人： Kumar Nagarajan ,  Sarathy Rajagopalan

IPC分类号： H05K506

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

摘要： A packaging substrate includes a plurality of bonding pads and a plurality of gutters formed thereon. A die having conductive bumps on an electrically active surface thereof is positioned such that the conductive bumps of the die are electrically connected to the bonding pads of the packaging substrate. An underfill material fills the underfill space between the packaging substrate and the die to complete the structure. The plurality of gutters creates a linear flow front of the underfill material as it flows across the underfill space.

摘要翻译： 封装基板包括多个接合焊盘和形成在其上的多个沟槽。 在其电活性表面上具有导电凸块的模具被定位成使得模具的导电凸块电连接到封装衬底的焊盘。 底部填充材料填充包装基板和模具之间的底部填充空间以完成该结构。 当底部填充材料流过底部填充空间时，多个水槽产生底部填充材料的线性流动前部。