公开(公告)号：US20180321715A1

公开(公告)日：2018-11-08

申请号：US15584741

申请日：2017-05-02

Applicant: Seagate Technology, LLC

Inventor： Shankar Gopalakrishna ,  Vivekananda Avvaru ,  Saju Cheeran Verhgese Francis

IPC: G06F1/20 ,  H01L23/40

CPC classification number: G06F1/20 ,  F28D15/00 ,  H01L23/02 ,  H01L23/4093

Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.

公开(公告)号：US20220104383A1

公开(公告)日：2022-03-31

申请号：US17546743

申请日：2021-12-09

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Kiran Padmakumari Devapalan

IPC: H05K7/18 ,  H05K7/14 ,  H05K5/02 ,  G11B33/12

Abstract: Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices are positioned away from the interface end region of the carriers, interface adapters may be coupled to the interfaces of the devices, which may present a different interface for operable coupling to an enclosure.

公开(公告)号：US20190200481A1

公开(公告)日：2019-06-27

申请号：US15853203

申请日：2017-12-22

Applicant: Seagate Technology LLC

Inventor： Vivekananda Avvaru ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Odie Killen

IPC: H05K7/20 ,  H05K7/14 ,  F21V33/00

CPC classification number: H05K7/20172 ,  F21V33/0096 ,  F21Y2115/10 ,  H05K7/1421 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/20727

Abstract: A system includes a drawer and a fan assembly. The drawer includes a mounting structure with a support surface and an aperture. The fan assembly extends through the aperture and includes a fan module and a top cover. The top cover is coupled to the support surface.

公开(公告)号：US20190166714A1

公开(公告)日：2019-05-30

申请号：US15824816

申请日：2017-11-28

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Kiran Padmakumari Devapalan

IPC: H05K7/18 ,  H05K5/02 ,  H05K7/14

Abstract: Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices are positioned away from the interface end region of the carriers, interface adapters may be coupled to the interfaces of the devices, which may present a different interface for operable coupling to an enclosure.

公开(公告)号：US10297289B1

公开(公告)日：2019-05-21

申请号：US15925350

申请日：2018-03-19

Applicant: Seagate Technology LLC

Inventor： Nived Chandroth Korambeth ,  Kiran Devapalan ,  Shankar Gopalakrishna ,  Yogeesha Bidare Manjunathaiah

IPC: G06K1/16 ,  H05K5/00 ,  H05K7/00 ,  G11B33/12 ,  H05K7/14 ,  G06F1/18

Abstract: A loader assembly includes a base, a moveable lock, a lower lock, and an upper lock. The base has a top side, a bottom side, a leading edge, and a trailing edge. The moveable lock is configured to move with respect to the base, and the moveable lock includes a tip portion configured to engage a storage media carrier. The lower lock extends from the top side of the base near the leading edge. And, the upper lock extends from the top side near the trailing edge.