公开(公告)号：US08320125B1

公开(公告)日：2012-11-27

申请号：US12631644

申请日：2009-12-04

申请人： William Hamburgen ,  Jimmy Clidaras ,  Winnie Leung ,  David W. Stiver ,  Jonathan D. Beck ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Gregory P. Imwalle ,  Amir M. Michael

发明人： William Hamburgen ,  Jimmy Clidaras ,  Winnie Leung ,  David W. Stiver ,  Jonathan D. Beck ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Gregory P. Imwalle ,  Amir M. Michael

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H05K7/2079 ,  Y10T29/49826

摘要： A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

摘要翻译： 数据中心冷却装置包括便携式外壳，其具有用于移动设备的提升和传送结构，壳体中的相对侧，至少一个相对侧限定一个或多个空气通道开口，其布置成从机架安装的电子设备捕获温暖的空气， 端部在壳体中，相对的端部中的至少一个限定一个或多个空气通道开口，其定位成允许捕获的空气横向通过壳体和/或从壳体中流出，以及与壳体相关联的一个或多个冷却盘管，以接收和冷却所捕获的 并提供冷却的空气循环进入数据中心工作区。

公开(公告)号：US20130107448A1

公开(公告)日：2013-05-02

申请号：US13685483

申请日：2012-11-26

申请人： William Hamburgen ,  Jimmy Clidaras ,  Winnie Leung ,  David W. Stiver ,  Jonathan D. Beck ,  Andrew B. Carlson ,  Steven T.Y. Chow ,  Gregory P. Imwalle ,  Amir M. Michael

发明人： William Hamburgen ,  Jimmy Clidaras ,  Winnie Leung ,  David W. Stiver ,  Jonathan D. Beck ,  Andrew B. Carlson ,  Steven T.Y. Chow ,  Gregory P. Imwalle ,  Amir M. Michael

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  H05K7/2079 ,  Y10T29/49826

摘要： A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

摘要翻译： 数据中心冷却装置包括便携式外壳，其具有用于移动设备的提升和传送结构，壳体中的相对侧，至少一个相对侧限定一个或多个空气通道开口，其布置成从机架安装的电子设备捕获温暖的空气， 端部在壳体中，相对的端部中的至少一个限定一个或多个空气通道开口，其定位成允许捕获的空气横向通过壳体和/或从壳体中流出，以及与壳体相关联的一个或多个冷却盘管，以接收和冷却所捕获的 并提供冷却的空气循环进入数据中心工作区。

公开(公告)号：US08456840B1

公开(公告)日：2013-06-04

申请号：US13093098

申请日：2011-04-25

申请人： Jimmy Clidaras ,  William Hamburgen ,  Winnie Leung ,  David W. Stiver ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Jonathan D. Beck

发明人： Jimmy Clidaras ,  William Hamburgen ,  Winnie Leung ,  David W. Stiver ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Jonathan D. Beck

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.

摘要翻译： 机架式计算机系统包括一行或多行计算机机架，其中每排计算机机架包括彼此相对定位的一对计算机机架，多个计算机主板安装在每个计算机机架 每排计算机机架中的机架，并且前边缘打开到用于接收主板上的循环空气的工作空间，主板被定位成在每个主板的后边缘附近形成温暖的空气增压室，以及与多个 计算机主板将空气流经计算机主板并进入暖空气通风室。

公开(公告)号：US09060451B2

公开(公告)日：2015-06-16

申请号：US11679024

申请日：2007-02-26

申请人： Jimmy Clidaras ,  Winnie Leung

发明人： Jimmy Clidaras ,  Winnie Leung

IPC分类号： H05K7/20

CPC分类号： H05K7/20754 ,  H05K7/20745 ,  H05K7/20836

摘要： A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.

摘要翻译： 公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度， 当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。

公开(公告)号：US20080204999A1

公开(公告)日：2008-08-28

申请号：US11679024

申请日：2007-02-26

申请人： Jimmy Clidaras ,  Winnie Leung

发明人： Jimmy Clidaras ,  Winnie Leung

IPC分类号： H05K7/20

CPC分类号： H05K7/20754 ,  H05K7/20745 ,  H05K7/20836

摘要： A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.

摘要翻译： 公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度， 当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。

公开(公告)号：US20080158818A1

公开(公告)日：2008-07-03

申请号：US11618611

申请日：2006-12-29

申请人： Jimmy Clidaras ,  Winnie Leung

发明人： Jimmy Clidaras ,  Winnie Leung

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20772

摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface, a second motherboard having a top surface and a bottom surface, and a heat sink in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the motherboards.

摘要翻译： 计算机装置包括具有顶表面和底表面的第一母板，具有顶表面和底表面的第二母板以及与第一和第二母板的顶表面导电热接触的散热器。 产生高热负荷的计算机部件被安装到主板的顶表面，并且产生低热负载的计算机部件被安装到一个或多个主板的底表面。

公开(公告)号：US07564685B2

公开(公告)日：2009-07-21

申请号：US11618611

申请日：2006-12-29

申请人： Jimmy Clidaras ,  Winnie Leung

发明人： Jimmy Clidaras ,  Winnie Leung

IPC分类号： H02K7/20 ,  F28F7/00

CPC分类号： H05K7/20727 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20772

摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that generate low thermal loads. A heat sink is in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the first and second motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the first and second motherboards.

摘要翻译： 计算机装置包括具有顶表面和底表面的第一母板和具有顶表面和底表面的第二母板。 主板各自安装有产生高热负荷的部件和产生低热负荷的部件。 散热器与第一和第二主板的顶表面导电热接触。 产生高热负荷的计算机部件被安装到第一和第二母板的顶表面，并且产生低热负荷的计算机部件安装到第一和第二主板中的一个或多个的底表面。

公开(公告)号：US09395508B1

公开(公告)日：2016-07-19

申请号：US13345147

申请日：2012-01-06

申请人： William Dailey ,  Winnie Leung ,  Angela Ying-Ju Chen ,  Michael John Bliss

发明人： William Dailey ,  Winnie Leung ,  Angela Ying-Ju Chen ,  Michael John Bliss

IPC分类号： G02B6/44

CPC分类号： H05K7/1489 ,  G02B6/4452 ,  G02B6/4471 ,  H04Q1/09 ,  H05K7/1417 ,  H05K7/1488 ,  H05K7/1492

摘要： Aspects of the disclosure relate generally to rack systems for housing computing devices. The rack may include shelves supported by flanges of a pair of corresponding inserts. The flanges may be spaced along the length of each of the inserts. The distance between the flanges may define the height of a shelf when placed in the rack. The pair of corresponding inserts may be placed along an inner sidewall of the rack by mating hooks of the inserts with corresponding slots of the inner sidewall and subsequently removed by demating the hooks and slots. For example, a pair of inserts with one distance between the flanges may be replaced by a pair of inserts with another distance between the flanges in order to increase the shelf height of the rack. By replacing the shelves and/or the inserts, a user may quickly and easily in order to reconfigure the rack.

摘要翻译： 本公开的方面通常涉及用于外壳计算设备的机架系统。 机架可以包括由一对相应插入件的凸缘支撑的搁板。 凸缘可以沿着每个插入件的长度间隔开。 凸缘之间的距离可以限定架子放置在机架中时的高度。 一对相应的插入件可以通过插入件的钩与内侧壁的相应槽配合而沿着齿条的内侧面放置，随后通过使钩和槽排出来去除。 例如，在凸缘之间具有一个距离的一对插入件可以被一对插入件替代，以在凸缘之间具有另一距离，以便增加机架的搁架高度。 通过更换架子和/或插入件，用户可以快速而容易地重新配置机架。