Abstract:
A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 8 amperes. The heat dissipation module has a housing, a plurality of air holes on in panels of the housing, an air outlet in a rear panel of the housing, a heat dissipation module in the housing, the heat dissipation module having a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base having a plurality of holes corresponding to at least one high-power element, the high-power element being arranged on one face of the heat-dissipating plate and near the air outlet, and the high-power element having pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
Abstract:
A heat dissipation apparatus has an enclosure, in which a lateral fan seat is integrally formed with the enclosure. The lateral fan seat divides the interior space of the enclosure into an upper chamber and a lower chamber. An axis is installed across the upper and the lower chambers through a center of the fan seat. A coil set, a magnetic element and a plurality of blades are mounted about the axis in each of the upper and lower chambers. Thereby, two sets of fans are formed in a single enclosure to increase the heat dissipation effect while the assembly convenience is improved.
Abstract:
The disclosure describes a touch device including a touching area having a first edge and a second edge; two reflective lens arrays and two laser source modules which are all disposed at the first edge and the second edge respectively, wherein each laser source module includes a laser diode and a diffractive optical element assembled in front of the laser diode for separating a laser beam projected from the laser diode to a plurality of laser beams with equal magnitude, the laser beams are distributed in a parallel arrangement over the touching area by the reflective lens array; and two receiving devices disposed at the corresponding edges of the first edge and the second edge respectively. The receiving device includes a plurality of sensing units, wherein each sensing unit receives one of the laser beams respectively.
Abstract:
The present disclosure provides an optical touch system and a positioning method thereof based on stereo vision theory. The proposed optical touch system adopts at least two adjustable linear image sensors to capture image information so that the information can be applicable to different sizes of touch screens by adjusting locations of the image sensors. Sensing area covers the whole screen without the need to increase quantity of sensors; besides, the present disclosure also provides a positioning method for the optical touch system, malting the spectra emitted by a stylus correspond to the image sensors, which leaves out complicated image processing to improve the speed and accuracy of touch response.
Abstract:
A heat dissipation module is used for a high-power semiconductor laser device with an operation current below 2 amperes and has a housing, a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing, and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate. The base has a plurality of holes corresponding to a current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
Abstract:
A heat dissipation module is used for high-power semiconductor laser device with operation current below 3.5 amperes and has a housing with a plurality of air holes in side panels of the housing, an air outlet on a rear panel of the housing and a heat dissipation module in the housing. The heat dissipation module has a heat-dissipating plate and a base placed beside the heat-dissipating plate, the base has a plurality of holes corresponding to at least one current controller, the current controller is arranged on one face of the heat-dissipating plate and near the air outlet, and the current controller has pins connected to holes on the base through insulating unit and wire. Therefore, the high-power semiconductor laser device can be operated at a stable temperature.
Abstract:
A vacuum laser constant temperature device is adopted for a housing that has a heat dissipation module arranged therein. The device has a metallic partition adjacent to the heat dissipation module to enclose a airtight vacancy formed with the housing, a thermoelectric cooling chip with a heating portion connecting to a side of the metallic partition and a cooling portion, a semiconductor laser lighting module arranged in the airtight vacancy and connecting to the cooling portion of the thermoelectric cooling chip, and a heat insulation layer arranged both on an opposite side of the metallic partition and in the airtight vacancy. Heat generated by the semiconductor laser lighting module can be transferred to the heat dissipation module via the thermoelectric cooling chip and the metallic partition. The thermoelectric cooling chip makes an output power of the semiconductor laser lighting module keep constant within various environments without the condensation thereon.