公开(公告)号：US10400058B2

公开(公告)日：2019-09-03

申请号：US15534557

申请日：2015-05-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayang Deng ,  Zengbiao Huang ,  Qianfa Liu ,  Zhongqiang Yang ,  Peng Wang

IPC: C08G59/66 ,  B32B15/092 ,  C08J5/24 ,  C08G59/56 ,  C08L63/00 ,  C08G59/24 ,  C08G59/50 ,  C08J5/04 ,  C08J11/04 ,  C08K3/36 ,  C08J3/24 ,  C08J11/16 ,  C08J11/18

Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

公开(公告)号：US09611377B2

公开(公告)日：2017-04-04

申请号：US14680806

申请日：2015-04-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jiang You ,  Tianhui Huang ,  Zhongqiang Yang

IPC: B32B27/38 ,  C08K5/357 ,  C08J5/24 ,  C08K3/36 ,  C08G59/40 ,  C08K5/35

CPC classification number: C08K5/357 ,  C08G59/4071 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K5/35 ,  C08L63/00

Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.