-
Patent Agency Ranking
1.发明申请Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same 审中-公开无卤素热固性树脂组合物，由其制备的印刷电路用预浸料和层压板公开(公告)号：US20160185952A1
公开(公告)日：2016-06-30
申请号：US14679372
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/3218 , C08G59/4071 , C08G59/621 , C08J2363/00 , C08K5/0066 , C08K5/49 , C08K5/5317 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of dicyclopentadiene novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的预浸料和印刷电路层压板。 无卤热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）5至30重量份的第一 含磷双酚的固化剂，（C）5-30重量份二环戊二烯酚醛清漆的第二固化剂，（D）含磷阻燃剂。 由本发明的无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料具有高的玻璃化转变温度，优异的介电性能，低吸水性，高耐热性和更好的工艺加工性，并且可以实现无卤素火焰 延迟并达到UL94 V-0的等级。
-
公开(公告)号：US09611377B2
公开(公告)日：2017-04-04
申请号：US14680806
申请日：2015-04-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08K5/357 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/35 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
-
公开(公告)号：US09752028B2
公开(公告)日：2017-09-05
申请号：US14679387
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/621 , C08K3/36 , C08K5/0066 , C08K5/523 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
-
4.发明申请Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same 有权无卤素热固性树脂组合物，由其制备的印刷电路用预浸料和层压板公开(公告)号：US20160185953A1
公开(公告)日：2016-06-30
申请号：US14679387
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/621 , C08K3/36 , C08K5/0066 , C08K5/523 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的预浸料和印刷电路层压板。 无卤热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）5至30重量份的第一 含磷双酚的固化剂，（C）5〜30重量份烷基酚酚醛清漆的第二固化剂，（D）含磷阻燃剂。 由本发明的无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料具有高的玻璃化转变温度，优异的介电性能，低吸水性，高耐热性和更好的工艺加工性，并且可以实现无卤素火焰 延迟并达到UL94 V-0的等级。
-
5.发明申请HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME 有权无卤素热固性树脂组合物，以及使用该印刷电路的PREPREG和层压板公开(公告)号：US20160185939A1
公开(公告)日：2016-06-30
申请号：US14680806
申请日：2015-04-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08K5/357 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/35 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料。 无卤素热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）20至50重量份的化合物 含有二氢苯并恶嗪环，（C）10〜40重量份的含磷双酚固化剂。 由本发明的无卤素热固性树脂组合物制备的印刷电路用预浸料和层压材料具有玻璃化转变温度高，介电性能优异，吸水率低，耐热性高，加工性好的优点，可以实现无卤阻燃 并达到UL94 V-0级。
-
-
-
-
Search Results
5
records
(took 0.015 seconds)
