公开(公告)号：US20210024749A1

公开(公告)日：2021-01-28

申请号：US16910619

申请日：2020-06-24

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Shoichi OSADA ,  Norifumi KAWAMURA ,  Kenji HAGIWARA ,  Ryuhei YOKOTA

IPC分类号： C08L79/08 ,  C08K3/22 ,  H01B3/30 ,  H01B19/04

摘要： Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB2O4   (1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.

公开(公告)号：US20160251511A1

公开(公告)日：2016-09-01

申请号：US15053730

申请日：2016-02-25

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Shoichi OSADA ,  Ryuhei YOKOTA ,  Hiroki OISHI ,  Tadaharu IKEDA

IPC分类号： C08L63/00 ,  H01L23/29

CPC分类号： C08L63/00 ,  C08G59/621 ,  C08G77/14 ,  C08G77/42 ,  C08K3/36 ,  C08K5/3442 ,  C08K5/50 ,  C08K5/5377 ,  C08L63/04 ,  C08L83/10 ,  H01L23/296

摘要： The purposes of the present invention is to provide a resin composition which provides a cured product which has a high glass transition temperature, a low moisture absorption and a good solder reflow property and small heat decomposition in storage at a high temperature for a long time, and has good moldability and good adhesiveness to a Cu lead frame. Thus, the present invention is to provide a composition comprising (A) an epoxy compound represented by the general formula (1); (B) a copolymer obtained by a hydrosilylation between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by the average compositional formula (2); (C) a phenol compound represented by the general formula (3); (D) an inorganic filler; (E) at least one compound selected from the group consisting of organic phosphines, tetra-substituted phosphonium tetraphenylborates and adducts of phosphines and quinones; and (F) a nitrogen-containing heterocyclic compound represented by the formula (I) or a salt thereof represented by the formula (II). Further, the present invention provides a semiconductor device provided with a cured product obtained by curing the composition.

摘要翻译： 本发明的目的是提供一种树脂组合物，其提供在高温下长时间储存​​时具有高玻璃化转变温度，低吸湿性和良好的回流焊性能以及小的热分解的固化产物， 并且具有良好的成型性和对Cu引线框架的良好的粘附性。 因此，本发明提供一种组合物，其包含（A）由通式（1）表示的环氧化合物; （B）通过含有链烯基的环氧化合物和由平均组成式（2）表示的有机聚硅氧烷之间的氢化硅烷化获得的共聚物; （C）由通式（3）表示的酚化合物; （D）无机填料; （E）选自有机膦，四取代鏻四苯基硼酸盐和膦和醌的加合物的至少一种化合物; 和（F）由式（I）表示的含氮杂环化合物或其由式（II）表示的盐。 此外，本发明提供一种具有通过固化该组合物而得到的固化物的半导体装置。