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公开(公告)号：US20210189043A1
公开(公告)日：2021-06-24
申请号：US17111853
申请日：2020-12-04
IPC分类号： C08F283/04 , C09J151/08 , C08J5/24 , C08K3/36 , C08K9/06
摘要： Provided is a heat-curable resin composition capable of yielding a cured product that has a superior dielectric property and heat resistance and is thus useful for high-frequency purposes. Particularly, there are provided a composition containing the following components (A), (C) and (D); and a composition containing the following components (A) and (B). The components (A), (B), (C) and (D) are: (A) a cyclopentadiene compound represented by the following formula (1) and/or an oligomer(s) of the cyclopentadiene compound wherein R represents a group selected from an alkyl group, an alkenyl group and an aryl group, n represents an integer of 1 to 4, each of x1 and x2 independently represents 0, 1 or 2, provided that when R represents an alkyl group or an aryl group, x1 represents 1 or 2, and x1 and x2 satisfy 1≤x1+x2≤4; (B) a cyclic imide compound; (C) a curing accelerator; and (D) an inorganic filler.
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公开(公告)号：US20210024749A1
公开(公告)日：2021-01-28
申请号：US16910619
申请日：2020-06-24
摘要： Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB2O4 (1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.
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3.发明申请RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A SEMICONDUCTOR DEVICE 审中-公开用于封装半导体元件和半导体器件的树脂组合物公开(公告)号：US20160251511A1
公开(公告)日：2016-09-01
申请号：US15053730
申请日：2016-02-25
发明人： Shoichi OSADA , Ryuhei YOKOTA , Hiroki OISHI , Tadaharu IKEDA
CPC分类号： C08L63/00 , C08G59/621 , C08G77/14 , C08G77/42 , C08K3/36 , C08K5/3442 , C08K5/50 , C08K5/5377 , C08L63/04 , C08L83/10 , H01L23/296
摘要： The purposes of the present invention is to provide a resin composition which provides a cured product which has a high glass transition temperature, a low moisture absorption and a good solder reflow property and small heat decomposition in storage at a high temperature for a long time, and has good moldability and good adhesiveness to a Cu lead frame. Thus, the present invention is to provide a composition comprising (A) an epoxy compound represented by the general formula (1); (B) a copolymer obtained by a hydrosilylation between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by the average compositional formula (2); (C) a phenol compound represented by the general formula (3); (D) an inorganic filler; (E) at least one compound selected from the group consisting of organic phosphines, tetra-substituted phosphonium tetraphenylborates and adducts of phosphines and quinones; and (F) a nitrogen-containing heterocyclic compound represented by the formula (I) or a salt thereof represented by the formula (II). Further, the present invention provides a semiconductor device provided with a cured product obtained by curing the composition.
摘要翻译： 本发明的目的是提供一种树脂组合物，其提供在高温下长时间储存时具有高玻璃化转变温度，低吸湿性和良好的回流焊性能以及小的热分解的固化产物， 并且具有良好的成型性和对Cu引线框架的良好的粘附性。 因此，本发明提供一种组合物，其包含（A）由通式（1）表示的环氧化合物; （B）通过含有链烯基的环氧化合物和由平均组成式（2）表示的有机聚硅氧烷之间的氢化硅烷化获得的共聚物; （C）由通式（3）表示的酚化合物; （D）无机填料; （E）选自有机膦，四取代鏻四苯基硼酸盐和膦和醌的加合物的至少一种化合物; 和（F）由式（I）表示的含氮杂环化合物或其由式（II）表示的盐。 此外，本发明提供一种具有通过固化该组合物而得到的固化物的半导体装置。
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公开(公告)号：US20210002474A1
公开(公告)日：2021-01-07
申请号：US16913836
申请日：2020-06-26
发明人： Shoichi OSADA , Hiroki OISHI , Norifumi KAWAMURA , Kenji HAGIWARA , Ryuhei YOKOTA , Masahiro KANETA
IPC分类号： C08L63/00
摘要： Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains: (A) an epoxy resin; (B) a phenolic curing agent; (C) a curing accelerator having a urea structure; (D) a laser direct structuring additive; and (E) an inorganic filler.
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公开(公告)号：US20180334567A1
公开(公告)日：2018-11-22
申请号：US15971019
申请日：2018-05-04
发明人： Norifumi KAWAMURA , Shoichi OSADA , Kohei OTAKE
CPC分类号： C08L83/10 , C08G59/1433 , C08G59/1494 , C08G59/4085 , C08G77/42 , C08K5/0041 , C08L2203/20
摘要： The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.
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6.发明申请SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISED OF CURED PRODUCT OF THE SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION 有权半导体封装树脂组合物和半导体器件包含半导体封装树脂组合物固化产物的半导体封装公开(公告)号：US20160336246A1
公开(公告)日：2016-11-17
申请号：US15133547
申请日：2016-04-20
发明人： Shoichi OSADA , Naoyuki KUSHIHARA , Ryuhei YOKOTA
IPC分类号： H01L23/29 , H01L23/31 , H01L23/495 , C09D179/00
CPC分类号： H01L23/293 , C08G8/04 , C08G73/0655 , C08G77/50 , C08K5/55 , C08L61/06 , C08L63/00 , C08L79/04 , C08L83/10 , C09D161/06 , C09D179/00 , C09D179/04 , H01L23/296 , H01L23/3107 , H01L23/49582 , H01L29/1608 , H01L29/2003
摘要： Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.
摘要翻译： （A）中（B）与氰酸基之间的酚羟基的摩尔比为0.08〜0.25，（A）中（C）和（D）中的环氧基与氰酸基的摩尔比为0.04〜0.25。
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公开(公告)号：US20220372274A1
公开(公告)日：2022-11-24
申请号：US17734325
申请日：2022-05-02
摘要： Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.
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公开(公告)号：US20190144704A1
公开(公告)日：2019-05-16
申请号：US16168005
申请日：2018-10-23
发明人： Norifumi KAWAMURA , Shoichi OSADA
摘要： The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.
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9.发明申请PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 有权PREPREG，金属层压板，印刷电路板和半导体器件公开(公告)号：US20130088842A1
公开(公告)日：2013-04-11
申请号：US13646266
申请日：2012-10-05
发明人： Shoichi OSADA
CPC分类号： B32B15/08 , B32B15/14 , B32B2260/023 , B32B2260/046 , B32B2305/076 , B32B2457/08 , C08J5/10 , C08J5/24 , C08J2363/00 , C08K3/22 , C08K3/24 , C08K3/26 , C08K7/14 , C08K2003/221 , C08L63/00 , H01L24/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2924/00014 , H01L2924/181 , H01L2224/48 , H01L2924/00015 , H01L2924/00
摘要： A prepreg that yields a semiconductor device which, even when using Cu wire, exhibits excellent reliability under conditions of high temperature and high humidity (heat-resistant and moisture-resistant reliability), a metal-clad laminate and a printed wiring board that use the prepreg, and a semiconductor device that uses the printed wiring board. Specifically disclosed are a prepreg comprising a substrate and a B-staged resin composition comprising (a) a thermosetting resin, (b) a hydrotalcite compound having a specific composition, (c) zinc molybdate, and (d) lanthanum oxide.
摘要翻译： 产生半导体器件的预浸料，即使使用Cu线，在高温高湿（耐热，耐湿可靠性）的条件下也显示出良好的可靠性，覆盖金属箔的层压板和印刷电路板使用 预浸料，以及使用印刷电路板的半导体装置。 具体公开了包含基材和B阶树脂组合物的预浸料，其包含（a）热固性树脂，（b）具有特定组成的水滑石化合物，（c）钼酸锌和（d）氧化镧。
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