摘要:
A coil assembly having a simplified bobbin structure and facilitating connection of a draw-out portion of a wire to a pin terminal. A coil assembly includes first and second pin support portions protruding in a protruding direction from a terminal base. First and second pin terminals protrude in the protruding direction from free end faces of the first and second pin support portions, respectively. The draw-out portion is electrically connected to an associated one of the pin terminals. The second pin support portion provides a protruding length from the terminal base greater than that of the first pin support portion, and the free end face of the second pin support portion is positioned downstream, in the protruding direction, of an imaginary linear draw-out portion directed linearly from the wire engaging portion to the first pin terminal, such that the second pin support portion is positioned and sized to intersect with the imaginary linear draw-out portion.
摘要:
A method of producing a photoelectric conversion element, which the element contains an electrically conductive support, a photosensitive layer having porous semiconductor fine particles, a charge transfer layer; and a counter electrode;containing the steps of: applying a semiconductor fine particle dispersion liquid, in which the content of solids excluding semiconductor fine particles is 10% by mass or less based on the total amount of the dispersion liquid, on the support, to form a coating; heating the coating, to obtain porous semiconductor fine particles; and sensitizing the porous particles by adsorption of the following dye: wherein X represents a group of non-metallic atoms necessary for forming a 7-membered ring; Y represents a dye residue; n represents an integer of 1 or more; Z represents a substituent; m represents 0 or a positive integer; and R1 represents a hydrogen atom or a specific substituent.
摘要:
A coil device 10 comprises a bobbin 40 having a bobbin plate 42 provided with a first hollow cylinder 44 on which a primary coil 20 is wound, and a case 50 provided with a second hollow cylinder 54 wound by a secondary coil 30 at the outer circumference. On the bobbin plate 42, a primary terminal 70 connecting to the primary coil 20 and a secondary terminal 72 connecting to the secondary coil 30 are formed, and a tip end portion 55a of case 50 is extended to the end portion of the bobbin plate 42 to which the secondary terminal 72 is formed. Further, on the tip end portion 55a, plural first grooves 57a for lead are formed.
摘要:
A method of producing a photoelectric conversion element, which the element contains an electrically conductive support, a photosensitive layer having porous semiconductor fine particles, a charge transfer layer; and a counter electrode, includes the steps of: applying a semiconductor dispersion liquid, in which the content of solids excluding semiconductor fine particles is 10% by mass or less based on the total amount of the dispersion liquid, on the support, to form a coating; heating the coating, to obtain porous semiconductor fine particles; and sensitizing the porous particles by adsorption of the following dye: wherein A represents a group of atoms necessary for forming a ring; at least one of Y1 and Y2 represents an acidic group and the other represents an electron-attracting group; D represents a dye residue; n represents 1 or a greater integer; L represents a single bond or divalent linking group; and Y3 represents an acidic group.
摘要:
An image processing apparatus includes an input unit that inputs a command, a wireless interface unit that wirelessly exchanges data with an image forming apparatus in a direct manner, a transmission/reception control unit that controls an operation of the wireless interface unit, and a program processing unit that performs an installation process of a program. The transmission/reception control unit causes the wireless interface unit to receive a driver module from the image forming apparatus. The program processing unit performs an installation process of the driver module received by the wireless interface unit.