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46 条记录 (耗时 0.034 秒)

    Compliant hard template for UV imprinting
    14.
    发明授权
    Compliant hard template for UV imprinting 有权
    适用于UV印记的硬模板

    公开(公告)号：US07140861B2

    公开(公告)日：2006-11-28

    申请号：US10833240

    申请日：2004-04-27

    申请人： Michael P. C. Watts ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan

    发明人： Michael P. C. Watts ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan

    IPC分类号： B29C59/02

    CPC分类号： G03F7/0002 ,  B29C43/003 ,  B29C2043/025 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0017

    摘要： A compliant UV imprint lithography template, which may also act as a thermal implant template, and methods for manufacturing it. The template essentially comprises a relief image and an elastomer adapted to adjust the relief image. In an embodiment, the relief image is arranged in a compliant imprinting layer where the elastomer is arranged between the imprinting layer and a rigid transparent substrate. In an embodiment, the template is compliant to a wafer surface. In an embodiment, layering an elastomer and an imprinting layer on a substrate and patterning a relief image into the imprinting layer, form the template.

    摘要翻译： 还可以充当热植入模板的兼容UV压印光刻模板及其制造方法。 模板基本上包括浮雕图像和适于调整浮雕图像的弹性体。 在一个实施例中，浮雕图像被布置在柔性压印层中，其中弹性体布置在压印层和刚性透明衬底之间。 在一个实施例中，模板符合晶片表面。 在一个实施例中，在基底上层叠弹性体和压印层并将浮雕图案图案化成压印层，形成模板。

    Forming a layer on a substrate
    15.
    发明授权
    Forming a layer on a substrate 有权
    在基材上形成一层

    公开(公告)号：US08066930B2

    公开(公告)日：2011-11-29

    申请号：US12749552

    申请日：2010-03-30

    申请人： Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    发明人： Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC分类号： B29C41/12 ,  B81C1/00

    CPC分类号： G03F7/0002 ,  B29C59/02 ,  B82Y10/00 ,  B82Y40/00

    摘要： The present invention is directed to a method of forming an imprinting layer on a substrate including high resolution features, and transferring the features into a solidified region of the substrate. Desired thickness of the residual layer may be minimized in addition to visco-elastic behavior of the material.

    摘要翻译： 本发明涉及一种在包括高分辨率特征的基板上形成压印层的方法，并将特征转移到基板的固化区域中。 除了材料的粘弹性行为之外，残留层的期望厚度可以最小化。

    Capillary imprinting technique
    16.
    发明授权
    Capillary imprinting technique 有权
    毛细管压印技术

    公开(公告)号：US07442336B2

    公开(公告)日：2008-10-28

    申请号：US10645306

    申请日：2003-08-21

    申请人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    发明人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC分类号： B29C35/08 ,  B29C41/12 ,  B81C1/00

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/08

    摘要： The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.

    摘要翻译： 本发明提供了一种用模板图案化模板的方法，该模板具有在基板和模具之间具有定位适形材料的模具，并且通过适形材料之间的毛细管作用在适形材料之间填充限定在模具和基板之间的体积， 模具和基材之一。 此后，使适形材料固化。 具体地说，模具和基板之间的距离被控制到足够的程度以减小模具和基板之间的压缩力（如果不是避免的话）。 结果，在模具与适形材料初次接触时，发生模具和基板之间的体积的自发毛细管填充。

    Method for fabricating bulbous-shaped vias
    18.
    发明授权
    Method for fabricating bulbous-shaped vias 失效
    制造球状通孔的方法

    公开(公告)号：US07071088B2

    公开(公告)日：2006-07-04

    申请号：US10227105

    申请日：2002-08-23

    申请人： Michael P. C. Watts ,  Sidlgata V. Sreenivasan

    发明人： Michael P. C. Watts ,  Sidlgata V. Sreenivasan

    IPC分类号： H01L21/44

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/0272 ,  H01L21/28587 ,  H01L21/312 ,  H01L21/76804 ,  H01L21/76817

    摘要： The present invention provides a method for fabricating bulbous-shaped vias on a substrate, having a surface, by disposing, on the substrate, a polymerizable fluid composition. A mold is placed in contact with the polymerizable fluid composition. The mold includes a relief structure on a surface thereof to create a recess in a layer of the polymerizable fluid composition. The polymerizable fluid composition is subjected to conditions to cause polymerization, forming a polymerized layer having a solidified indentation. An opening to the surface of the substrate is formed by removing material disposed on the substrate surface through etch processes. In a further embodiment a conductive layer may be disposed in the opening to form a gate. A lift-off process may be employed to remove the polymerized layer.

    摘要翻译： 本发明提供一种在基板上制造球状通孔的方法，其具有通过在基板上设置可聚合流体组合物的表面。 将模具放置成与可聚合流体组合物接触。 模具在其表面上包括浮雕结构，以在可聚合流体组合物的层中形成凹部。 可聚合流体组合物经历引起聚合的条件，形成具有固化压痕的聚合层。 通过蚀刻处理去除设置在基板表面上的材料来形成通向基板表面的开口。 在另一个实施例中，导电层可以设置在开口中以形成栅极。 可以采用剥离工艺来除去聚合层。

    Method to arrange features on a substrate to replicate features having minimal dimensional variability
    19.
    发明授权
    Method to arrange features on a substrate to replicate features having minimal dimensional variability 有权
    在衬底上布置特征以复制具有最小尺寸变化性的特征的方法

    公开(公告)号：US08349241B2

    公开(公告)日：2013-01-08

    申请号：US10264960

    申请日：2002-10-04

    申请人： Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    发明人： Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC分类号： B29C35/00 ,  B29C43/00

    CPC分类号： G03F7/0002 ,  B29C43/003 ,  B29C59/022 ,  B29C2035/0827 ,  B29C2035/0833 ,  B29C2043/025 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00

    摘要： The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.

    摘要翻译： 本发明涉及一种用于在基板上排列特征以用最小的尺寸变化来复制特征的方法和模具。 该方法包括在层上布置特征以使层中的厚度变化最小化，这可归因于该层上的多个特征的密度变化。 这些特征被转移到下面的基底中。 相信通过形成特征以在层中限定均匀的填充因子，如果不被废除，则可以减小厚度变化。 为此，根据本发明的一种方法包括在基底上形成可流动的材料。 此后，在可流动材料的区域中形成多个特征。 多个特征被布置成在该区域中提供基本均匀的填充因子。