公开(公告)号：US20170140966A1

公开(公告)日：2017-05-18

申请号：US14940467

申请日：2015-11-13

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Fu-Hsien Li ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC分类号： H01L21/677 ,  B25J11/00 ,  B65G1/04 ,  B61B13/04

CPC分类号： H01L21/67766 ,  B25J11/0095 ,  B61B13/04 ,  B65G1/0464 ,  B65G2201/0297 ,  H01L21/6773 ,  H01L21/67733

摘要： An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.

公开(公告)号：US11911991B2

公开(公告)日：2024-02-27

申请号：US17870640

申请日：2022-07-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Szu-Chen Huang ,  Fu-Hsien Li ,  Mao-Jung Chiu ,  Mao-Shun Lien ,  Po-Hsien Chiu

IPC分类号： B31B50/00 ,  B31B50/02 ,  B31B50/07 ,  B31B50/52 ,  B31B100/00

CPC分类号： B31B50/005 ,  B31B50/006 ,  B31B50/022 ,  B31B50/07 ,  B31B50/52 ,  B31B2100/00

摘要： An apparatus and method for expanding a box blank into a box, the apparatus comprising an arm assembly, a controller, a camera and a box blank conveyor. The arm assembly includes a folding arm having a position in a first direction and a rotational angle controlled by the controller based on a position of a feature of the box blank in the field of view of the camera. The camera captures images of the box blank which are used to position the arm assembly and to evaluate the need to reject a box blank.

公开(公告)号：US10703563B2

公开(公告)日：2020-07-07

申请号：US15884389

申请日：2018-01-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Guan-Cyun Li ,  Chi-Feng Tung ,  Fu-Hsien Li ,  Hsiang-Yin Shen

IPC分类号： B65G1/04 ,  H01L21/677

摘要： A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.

公开(公告)号：US20190144205A1

公开(公告)日：2019-05-16

申请号：US15884389

申请日：2018-01-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Guan-Cyun Li ,  Chi-Feng Tung ,  Fu-Hsien Li ,  Hsiang-Yin Shen

IPC分类号： B65G1/04

CPC分类号： B65G1/0435 ,  H01L21/67769

摘要： A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.

公开(公告)号：US10043699B2

公开(公告)日：2018-08-07

申请号：US14940467

申请日：2015-11-13

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Fu-Hsien Li ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC分类号： H01L21/677 ,  B25J11/00 ,  B61B13/04 ,  B65G1/04

摘要： An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.