-
公开(公告)号：US20200299060A1
公开(公告)日：2020-09-24
申请号：US16893409
申请日：2020-06-04
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04 , H01L21/677
摘要： A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.
-
公开(公告)号：US20170140966A1
公开(公告)日：2017-05-18
申请号：US14940467
申请日：2015-11-13
发明人： Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC分类号： H01L21/677 , B25J11/00 , B65G1/04 , B61B13/04
CPC分类号： H01L21/67766 , B25J11/0095 , B61B13/04 , B65G1/0464 , B65G2201/0297 , H01L21/6773 , H01L21/67733
摘要： An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.
-
公开(公告)号：US11735451B2
公开(公告)日：2023-08-22
申请号：US16808166
申请日：2020-03-03
发明人： Guancyun Li , Ching-Jung Chang , Chi-Feng Tung , Hsiang Yin Shen
IPC分类号： H01L21/67 , H01L21/677 , B65D81/02
CPC分类号： H01L21/67733 , B65D81/022 , H01L21/6773 , H01L21/67271 , H01L21/67706 , H01L21/67724
摘要： A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.
-
公开(公告)号：US11605553B2
公开(公告)日：2023-03-14
申请号：US17099734
申请日：2020-11-16
发明人： Fu-Hsien Li , Chi-Feng Tung , Chi Yuan Chu , Jen-Ti Wang , Hsiang Yin Shen
IPC分类号： B65B69/00 , H01L21/67 , H01L21/683
摘要： An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
-
公开(公告)号：US20210098275A1
公开(公告)日：2021-04-01
申请号：US16808166
申请日：2020-03-03
发明人： Guancyun LI , Ching-Jung Chang , Chi-Feng Tung , Hsiang Yin Shen
IPC分类号： H01L21/677 , H01L21/67
摘要： A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.
-
公开(公告)号：US10703563B2
公开(公告)日：2020-07-07
申请号：US15884389
申请日：2018-01-31
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04 , H01L21/677
摘要： A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.
-
公开(公告)号：US20190144205A1
公开(公告)日：2019-05-16
申请号：US15884389
申请日：2018-01-31
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04
CPC分类号： B65G1/0435 , H01L21/67769
摘要： A stocker for storing a plurality of wafer carriers is provided. The stocker includes a frame, a plurality of pod stoppers, a plurality of truss members and a plurality of partitions. The frame includes a plurality of stocking units. Each of the stocking units includes a carrying plate for carrying one of the plurality of wafer carriers. The pod stoppers stand on an edge of each of the carrying plates. The truss members are disposed diagonally across at least one side surface of at least one of the stocking units, wherein each of the truss members comprises a shock absorber. The partitions are disposed on side surfaces of the stocking units and fixed to the frame.
-
公开(公告)号：US10043699B2
公开(公告)日：2018-08-07
申请号：US14940467
申请日：2015-11-13
发明人： Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC分类号： H01L21/677 , B25J11/00 , B61B13/04 , B65G1/04
摘要： An overhead transport (OHT) system with multiple levels of rails for the transport of semiconductor workpieces is provided. A first vehicle is configured to travel on, and move a semiconductor workpiece along, a first rail. A second vehicle is configured to travel on, and move the semiconductor workpiece along, a second rail overlying the first rail. A controller is configured to control the first and second vehicles to transfer the semiconductor workpiece along the first and second rails, between process or inspection tools. A method for transferring semiconductor workpieces across multiple levels of rails is also provided.
-
公开(公告)号：US11720033B2
公开(公告)日：2023-08-08
申请号：US17476420
申请日：2021-09-15
CPC分类号： G03F7/70858
摘要： A method includes: storing a carrier containing material in a storage; recording environmental data of the storage to a database while the material is in the storage; generating a forecast for the material in the carrier based on the environmental data; receiving a request for the material from a semiconductor fabrication tool; and providing the carrier to the semiconductor fabrication tool based on the forecast.
-
公开(公告)号：US11001442B2
公开(公告)日：2021-05-11
申请号：US16893409
申请日：2020-06-04
发明人： Guan-Cyun Li , Chi-Feng Tung , Fu-Hsien Li , Hsiang-Yin Shen
IPC分类号： B65G1/04 , H01L21/677
摘要： A stocking system is provided. The stocking system includes a wafer carrier, a stocking unit, a plurality of pod stoppers and at least one positioning pin. The stocking unit is configured to store the wafer carrier, and includes a carrying plate for carrying the wafer carrier. The pod stoppers stand on an edge of the carrying plate. The at least one positioning pin is disposed on a front portion of the carrying plate, such that the wafer carrier leans against the at least one positioning pin and is tilted toward a back portion of the carrying plate.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.016 秒)
