公开(公告)号：US20250029788A1

公开(公告)日：2025-01-23

申请号：US18903183

申请日：2024-10-01

Applicant: TDK Corporation

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface, an end surface, and a side surface coupling the principal surface and the end surface. An external electrode is disposed on the element body and includes a conductive resin layer. An internal conductor is disposed in the element body and is exposed to the end surface. The element body includes a ridge portion between the end surface and the side surface, the ridge portion including a first region exposed from the conductive resin layer and a second region positioned closer to the principal surface than the first region and covered with the conductive resin layer.

公开(公告)号：US11232910B2

公开(公告)日：2022-01-25

申请号：US16097175

申请日：2017-09-20

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Koki Ito ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US10755861B2

公开(公告)日：2020-08-25

申请号：US15695645

申请日：2017-09-05

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Koki Ito ,  Hideki Kaneko

IPC: H01G4/018 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.

公开(公告)号：US09305708B2

公开(公告)日：2016-04-05

申请号：US14445894

申请日：2014-07-29

Applicant: TDK Corporation

Inventor： Nobutaka Kai ,  Yasuhiro Okui ,  Satoru Kindaichi ,  Hideki Kaneko ,  Tatsuya Kojima ,  Akitoshi Yoshii

IPC: H01G4/12 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/1218 ,  H01G4/1236 ,  H01G4/30

Abstract: A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer 3 and a dielectric layer 2 are laminated alternatively, wherein the dielectric layer 2 is comprised of a dielectric ceramic composition including a main component represented by a general formula of ABO3 and a rare-earth component R, and segregation phases 5 including the rare-earth component R are present in the dielectric layer 2. When the dielectric layer 2 is separated to six areas by dividing the dielectric layer 2 sandwiched by a pair of the internal dielectric layers 3 in the thickness direction, there are the R segregation phases present in two neighboring areas 2a respectively adjacent to the pair of the internal electrode layers 3 in the dielectric layer 3 at a ratio of double or more compared with the R segregation phases present in two central areas 2b located at a substantially center in the dielectric layer 2.

Abstract translation: 一种多层陶瓷电子器件，包括层叠体，其中内部电极层3和电介质层2交替层叠，其中介电层2由包含由通式ABO 3表示的主要成分和稀有金属的介电陶瓷组合物组成 - 电介质层2中存在包含稀土类成分R的偏析相5.当通过将介电层2夹在一对内部电介质层3之间的介电层2分开来将电介质层2分离为6个区域时 在厚度方向上，在与介电层3中的一对内部电极层3相邻的两个相邻区域2a中存在R偏析相，其比例为两倍以上，与存在于两个中心的R偏析相比较 位于电介质层2中的大致中心的区域2b。