公开(公告)号：US20230260698A1

公开(公告)日：2023-08-17

申请号：US18012834

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/01 ,  H01L25/16 ,  H01G4/33

CPC classification number: H01G4/01 ,  H01L25/16 ,  H01G4/33 ,  H01L24/16

Abstract: To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 μm in the planar direction and less than 5 μm in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.

公开(公告)号：US20230253446A1

公开(公告)日：2023-08-10

申请号：US18012809

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Yoshihiko YANO ,  Daiki ISHII ,  Kenichi YOSHIDA ,  Yuki YAMASHITA

IPC: H01G4/33 ,  H01G4/008

CPC classification number: H01L28/75 ,  H01L28/84 ,  H01G4/008 ,  H01G4/33

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.