公开(公告)号：US11817374B2

公开(公告)日：2023-11-14

申请号：US17229955

申请日：2021-04-14

Applicant: Texas Instruments Incorporated

Inventor： Chih-Chien Ho ,  Bo-Hsun Pan ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L21/50 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/4951 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/49 ,  H01L24/85 ,  H01L2924/181

Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.

公开(公告)号：US20230317571A1

公开(公告)日：2023-10-05

申请号：US17708038

申请日：2022-03-30

Applicant: Texas Instruments Incorporated

Inventor： Hsiang Ming Hsiao ,  Hung-Yu Chou ,  Yuh-Harng Chien ,  Chih-Chien Ho ,  Che Wei Tu ,  Bo-Hsun Pan ,  Megan Chang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49555 ,  H01L21/56 ,  H01L21/4821 ,  H01L23/3107

Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.

公开(公告)号：US20210043548A1

公开(公告)日：2021-02-11

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.