公开(公告)号：US20130034937A1

公开(公告)日：2013-02-07

申请号：US13646199

申请日：2012-10-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Frank Yu ,  Lance Wright ,  Chien-Te Feng ,  Sandra Horton

IPC: H01L21/56

CPC classification number: H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/30505 ,  H01L2224/30519 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the die. A die pad and leads are encapsulated within the molding material. The leads include an exposed portion that includes a bonding portion. A gap exposes the backside metal layer along a bottom surface of the package. Bond wires couple the pads on the topside of the die to the leads and the bonding portions. Packaged semiconductor device is soldered to a printed circuit board (PCB). The backside metal layer and the bonding portions of the leads are soldered substrate pads on said PCB.

Abstract translation: 形成电子组件的方法包括将半导体管芯的底部的背面金属层附着。 背面金属层的区域与模具的底部区域相匹配。 芯片焊盘和引线封装在模制材料内。 引线包括包括接合部分的暴露部分。 间隙沿着包装的底部表面暴露背面金属层。 接合线将管芯顶部的焊盘连接到引线和接合部分。 封装半导体器件焊接到印刷电路板（PCB）。 背面金属层和引线的接合部分是焊接在所述PCB上的衬底焊盘。

公开(公告)号：US20210043548A1

公开(公告)日：2021-02-11

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

公开(公告)号：US11081428B2

公开(公告)日：2021-08-03

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/492

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

公开(公告)号：US09272302B2

公开(公告)日：2016-03-01

申请号：US13946772

申请日：2013-07-19

Applicant: Texas Instruments Incorporated

Inventor： Frank Yu ,  Eric Hsieh ,  Kevin Jin

IPC: B05C11/10 ,  B29C47/02 ,  B29C47/00

CPC classification number: B05C11/10 ,  B29C47/0009 ,  B29C47/026

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract translation: 包括可移动的分配器组件。 分配器包括其中具有粘结粘合剂的储存器，其中包括颗粒和液体载体。 移动分配器以向分配器提供搅拌以将粘合粘合剂混合成均匀的颗粒混合物和液体载体。 在所述分配器的端部处的开口将粘合粘合剂分配到工件上的粘合位置上，而不从分离器附接装置移除分配器。 一个控制器，用于发送控制信号，该控制信号在将所述体积的粘结粘合剂分配到所述工件的所述表面上之前触发所述可移动分配器组件的移动以混合所述粘合粘合剂 控制器包括基于将参数比较在预定极限或范围内来控制诸如振荡之类的运动以保持粘合粘合剂良好混合的逻辑。

公开(公告)号：US08470644B2

公开(公告)日：2013-06-25

申请号：US13646199

申请日：2012-10-05

Applicant: Texas Instruments Incorporated

Inventor： Frank Yu ,  Lance C. Wright ,  Chien Te Feng ,  Sandra J. Horton

IPC: H01L21/00

CPC classification number: H01L23/4951 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/30181 ,  H01L2224/30505 ,  H01L2224/30519 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the die. A die pad and leads are encapsulated within the molding material. The leads include an exposed portion that includes a bonding portion. A gap exposes the backside metal layer along a bottom surface of the package. Bond wires couple the pads on the topside of the die to the leads and the bonding portions. Packaged semiconductor device is soldered to a printed circuit board (PCB). The backside metal layer and the bonding portions of the leads are soldered substrate pads on said PCB.

Abstract translation: 形成电子组件的方法包括将半导体管芯的底部的背面金属层附着。 背面金属层的区域与模具的底部区域相匹配。 芯片焊盘和引线封装在模制材料内。 引线包括包括接合部分的暴露部分。 间隙沿着包装的底部表面暴露背面金属层。 接合线将管芯顶部的焊盘连接到引线和接合部分。 封装半导体器件焊接到印刷电路板（PCB）。 背面金属层和引线的接合部分是焊接在所述PCB上的衬底焊盘。

公开(公告)号：US20130298827A1

公开(公告)日：2013-11-14

申请号：US13946772

申请日：2013-07-19

Applicant: Texas Instruments Incorporated

Inventor： Frank Yu ,  Eric Hsieh ,  Kevin Jin

IPC: B05C11/10

CPC classification number: B05C11/10 ,  B29C47/0009 ,  B29C47/026

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract translation: 包括可移动的分配器组件。 分配器包括其中具有粘结粘合剂的储存器，其中包括颗粒和液体载体。 移动分配器以向分配器提供搅拌以将粘合粘合剂混合成均匀的颗粒混合物和液体载体。 在所述分配器的端部处的开口将粘合粘合剂分配到工件上的粘合位置上，而不从分离器附接装置移除分配器。 一个控制器，用于发送控制信号，该控制信号在将所述体积的粘结粘合剂分配到所述工件的所述表面上之前触发所述可移动分配器组件的移动以混合所述粘合粘合剂 控制器包括基于将参数比较在预定极限或范围内来控制诸如振荡之类的运动以保持粘合粘合剂良好混合的逻辑。