公开(公告)号：US20180190608A1

公开(公告)日：2018-07-05

申请号：US15840497

申请日：2017-12-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Vikas Gupta ,  Daniel Yong Lin

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L24/16 ,  H01L21/4825 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/10175 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the semiconductor device. A reflow wall is on a portion of the lead frame and is in contact with the solder joint. A molding compound covers portions of the semiconductor device, the lead frame, the solder joint, and the reflow wall.