公开(公告)号：US12163854B2

公开(公告)日：2024-12-10

申请号：US17668136

申请日：2022-02-09

Applicant: The Regents of the University of Michigan

Inventor： Alexander Benken ,  Yogesh Gianchandani

IPC: G01L9/00

Abstract: A capacitive sensor device is fabricated on a dielectric substrate. The capacitive sensor device may include multiple diaphragms that differ in shape and/or size. Each of the diaphragms is paired to upper and lower electrodes in included upper and lower electrode layers, respectively. The lower layer is on the dielectric substrate and couples the lower electrodes to a lower electrode terminal in parallel. The upper electrode layer is separated from the lower electrode layer by a gap defined by a removed sacrificial layer and couples the upper electrodes in parallel to an upper electrode terminal.

公开(公告)号：US20210067137A1

公开(公告)日：2021-03-04

申请号：US17006014

申请日：2020-08-28

Applicant: The Regents of the University of Michigan

Inventor： Scott R. GREEN ,  Yogesh Gianchandani ,  Ramprasad M. Nambisan ,  Jiqing Jiang

IPC: H03H9/22 ,  H03H3/06

Abstract: A resonator comprising a magnetoelastic body having a mass load portion and an active resonating portion can be used in implementations such as a security tag. The resonator includes a mass at the mass load portion of the magnetoelastic body. Displacement of the magnetoelastic body is configured to occur at both the mass load portion and the active resonating portion. A strain at the active resonating portion during displacement is configured to be greater than a strain at the mass load portion during displacement.

公开(公告)号：US10557898B2

公开(公告)日：2020-02-11

申请号：US15113178

申请日：2015-01-23

Applicant: The Regents of The University of Michigan

Inventor： Yogesh Gianchandani ,  Jun Tang ,  Scott Green

IPC: G01R33/18 ,  G01R33/038 ,  G01L1/12

Abstract: A magnetoelastic tag includes a frame-suspended magnetoelastic resonator that combines a strong resonant response with a relatively small resonator, enabling magnetoelastic sensor use in a variety of inconspicuous applications and/or small packages. The resonator is suspended with respect to a substrate, which reduces, minimizes, or eliminates interaction between the substrate and resonator. Signal strength is thereby enhanced, thereby allowing miniaturization while maintaining a measurable response to the interrogation field. The resonator can have a hexagonal shape and/or be suspended at particular locations about its perimeter to promote signal generation in a direction different from that of the interrogation field. A sensor can include one or more frame-suspended resonators, which can be arranged in an array, stacked, or randomly where a plurality of resonators is employed.

公开(公告)号：US09950922B2

公开(公告)日：2018-04-24

申请号：US15127237

申请日：2015-03-17

Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Inventor： Yogesh Gianchandani ,  Tao Li ,  Yushu Ma

IPC: B81B7/00 ,  B81B7/02 ,  B81C3/00 ,  H01L23/043 ,  H01L23/053

CPC classification number: B81B7/0048 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/02 ,  B81B2201/0264 ,  B81C3/00 ,  B81C3/002 ,  B81C3/004 ,  H01L23/043 ,  H01L23/053

Abstract: A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.