公开(公告)号：US20230337544A1

公开(公告)日：2023-10-19

申请号：US18140577

申请日：2023-04-27

申请人： The Regents of the University of Michigan ,  Qualcomm Technologies, Inc.

发明人： Karl Grosh ,  Robert J. Littrell

IPC分类号： H10N30/853 ,  B81B3/00 ,  H04R17/00 ,  H10N30/50 ,  B81B7/02 ,  H10N30/30 ,  H04R17/02 ,  B81B7/00

CPC分类号： H10N30/50 ,  B81B3/0021 ,  B81B7/0032 ,  B81B7/02 ,  H04R17/00 ,  H04R17/02 ,  H10N30/302 ,  H10N30/306 ,  H10N30/308 ,  H10N30/853 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/09 ,  H04R2201/003

摘要： A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

公开(公告)号：US11667518B2

公开(公告)日：2023-06-06

申请号：US17419191

申请日：2019-11-05

申请人： NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)

发明人： Xiaoshan Qin

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0032 ,  B81C1/0023 ,  B81B2201/02 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/092 ,  B81C2203/0118 ,  B81C2203/0792

摘要： A micro-electro-mechanical system (MEMS) package structure and a method for fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (200) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) and an input-output connecting member (420) are formed on a first bonding surface (100a) of the device wafer (100). The MEMS die (200) is coupled to the first bonding surface (100a) through a bonding layer (500). The MEMS die (200) includes a closed micro-cavity (220) and a second contact pad (220). The first contact pad (410) is electrically connected to a corresponding second contact pad (220). An opening (510) that exposes the input-output connecting member (420) is formed in the bonding layer (500). The MEMS package structure allows electrical interconnection between the MEMS die (200) and the device wafer (100) with a reduced package size, compared to those produced by existing integration techniques. In addition, function integration ability of the package structure is improved by integrating a plurality of MEMS dies of the same or different structures and functions on the same device wafer.

公开(公告)号：US20190206812A1

公开(公告)日：2019-07-04

申请号：US15857234

申请日：2017-12-28

申请人： Texas Instruments Incorporated

发明人： THOMAS DYER BONIFIELD ,  JEFFREY ALAN WEST ,  BYRON LOVELL WILLIAMS

IPC分类号： H01L23/64 ,  H01L27/07 ,  H01L23/00 ,  H01L49/02 ,  H01L25/00 ,  B81B7/00 ,  H01L25/065

CPC分类号： H01L23/642 ,  B81B7/0032 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/0733 ,  H01L28/40 ,  H01L2224/4807 ,  H01L2224/48137

摘要： A packaged multichip device includes a first IC die with an isolation capacitor utilizing a top metal layer as its top plate and a lower metal layer as its bottom plate. A second IC die has a second isolation capacitor utilizing its top metal layer as its top plate and a lower metal layer as its bottom plate. A first bondwire end is coupled to one top plate and a second bondwire end is coupled to the other top plate. The second bondwire end includes a stitch bond including a wire approach angle not normal to the top plate it is bonded to and is placed so that the stitch bond's center is positioned at least 5% further from an edge of this top plate on a bondwire crossover side compared to a distance of the stitch bond's center from the side opposite the bondwire crossover side.

公开(公告)号：US20180146302A1

公开(公告)日：2018-05-24

申请号：US15857709

申请日：2017-12-29

申请人： MERRY ELECTRONICS (SHENZHEN) CO., LTD.

发明人： Jen-Yi CHEN ,  Chao-Sen CHANG ,  Chun-Chieh WANG ,  Yong-Shiang CHANG

IPC分类号： H04R19/04 ,  B81B3/00 ,  B81B7/00 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B3/0021 ,  B81B7/0032 ,  B81B2201/0257 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/0023 ,  B81C1/00309 ,  B81C2203/0109 ,  H04R1/04 ,  H04R1/086 ,  H04R19/005 ,  H04R31/00

摘要： A MEMS microphone package structure is provided to have a circuit substrate, an acoustic wave transducer, an application-specific integrated circuit, a lid, and at least two solder pads. The circuit substrate has a top surface, a bottom surface, and a sound hole passing through the top surface and the bottom surface. The acoustic wave transducer and the application-specific integrated circuit are disposed on the top surface and electrically connected. The lid is disposed on the top surface and made by a multilayer printed circuit boards. The lid surrounds and covers the acoustic wave transducer and the application-specific integrated circuit. The lid further has a shielding layer completely disposed on inner surfaces of the lid and two embedded first metal layers served for signal transmission and grounding and electrically connected with the solder pads respectively.

公开(公告)号：US20180138099A1

公开(公告)日：2018-05-17

申请号：US15351241

申请日：2016-11-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yu-An FANG ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC分类号： H01L23/053 ,  H01L23/10

CPC分类号： H01L23/053 ,  B81B7/0032 ,  B81B7/0061 ,  B81C1/00269 ,  B81C1/00309 ,  H01L21/6836 ,  H01L23/04 ,  H01L23/10 ,  H01L2221/68331

摘要： A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

公开(公告)号：US20170313578A1

公开(公告)日：2017-11-02

申请号：US15647107

申请日：2017-07-11

申请人： mCube, Inc.

发明人： Chien Chen LEE ,  Tzu Feng CHANG

IPC分类号： B81B7/00 ,  B81C1/00 ,  G01L1/00 ,  G01C19/5783 ,  G01R33/02 ,  G01P15/08

CPC分类号： B81B7/0074 ,  B81B3/0035 ,  B81B3/0062 ,  B81B3/0072 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0054 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/0023 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/0792 ,  G01C19/5719 ,  G01C19/5783 ,  G01L1/00 ,  G01L9/0042 ,  G01L19/0069 ,  G01L19/147 ,  G01P15/0802 ,  G01R33/02 ,  H04R2201/003

摘要： A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

公开(公告)号：US09778043B1

公开(公告)日：2017-10-03

申请号：US15080425

申请日：2016-03-24

申请人： Inertial Sense, LLC

发明人： Walter H. Johnson

IPC分类号： G01C21/16 ,  G01S19/13

CPC分类号： G01C21/165 ,  B81B7/0032 ,  G01C19/5783 ,  G01P1/023 ,  G01S19/13 ,  G01S19/35 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Microchip assemblies, such as self-contained, aided, INS microchip assemblies configured for being coupled with a circuit board or another electrical component. In some embodiments, two inertial navigation sensors may be provided, along with a receiver configured to receive an external signal comprising location data or another aiding sensor, such as a barometric pressure sensor, magnetometer, or WIFI receiver. The assembly may further comprise a processor configured to receive inertial parameter data from inertial navigation sensors and location data from the receiver, and may be configured to process the inertial parameter data and location data to output inertial navigation information.

公开(公告)号：US09581468B2

公开(公告)日：2017-02-28

申请号：US14170355

申请日：2014-01-31

申请人： DunAn Sensing LLC

发明人： Tom T. Nguyen

IPC分类号： G01D11/24 ,  H01L23/10 ,  G01L19/14 ,  G01L19/06 ,  G01L5/16 ,  B23P11/00 ,  G01D11/26 ,  B81B7/00 ,  B81C1/00

CPC分类号： G01D11/245 ,  B23P11/005 ,  B81B7/0032 ,  B81B2201/0264 ,  B81C1/00261 ,  B81C3/00 ,  B81C2203/019 ,  G01D11/26 ,  G01L5/165 ,  G01L19/0672 ,  G01L19/14 ,  G01L19/145 ,  G12B9/06 ,  H01L23/10 ,  Y10T29/49872 ,  Y10T29/49874 ,  Y10T29/49913 ,  Y10T29/49915

摘要： Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

摘要翻译： 用于制造气密密封件以密封装置的一部分的方法，例如但不限于具有MEMS传感器的部分。 一种这样的方法使用压接装置来压缩形成在壳体中的空腔中的密封件，该密封件包括附接到应力隔离器的MEMS传感器。 在这种压缩状态下，密封件变形成密封密封应力隔离器内部，外部和底部的表面。

公开(公告)号：US09573800B2

公开(公告)日：2017-02-21

申请号：US14918521

申请日：2015-10-20

申请人： Invensense, Inc.

发明人： Thomas M. Goida

IPC分类号： B81B7/00 ,  H01L23/495 ,  H01L21/50

CPC分类号： B81B7/007 ,  B81B7/0032 ,  B81B7/0077 ,  B81B2201/0257 ,  B81B2207/093 ,  H01L21/50 ,  H01L23/495 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/3025 ,  H01L2924/00

摘要： A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

摘要翻译： MEMS引线框架封装体包围封装在由模具体和盖子形成的内部空腔中的MEMS装置。 为了容纳MEMS麦克风，声孔延伸穿过模具体。 在一些实施例中，导电柱延伸穿过预成型体，以允许从部分封装的引线框架到导电盖的电连接。 一些实施例可以包括在模具体内的多层空腔，用于安装由MEMS装置上方的间隙分开的集成电路。

公开(公告)号：US09496806B2

公开(公告)日：2016-11-15

申请号：US13953092

申请日：2013-07-29

申请人： Seiko Epson Corporation

发明人： Yusuke Matsuzawa

IPC分类号： H02N1/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC分类号： H02N1/006 ,  B81B3/0086 ,  B81B7/0006 ,  B81B7/0032 ,  B81B2201/0271 ,  B81B2203/04 ,  B81C1/00 ,  Y10T29/49117

摘要： A MEMS device is a MEMS device having a MEMS vibrator which includes a plurality of MEMS constituent elements laminated and formed above a first foundation portion which is laminated above a main surface of a wafer substrate, and the MEMS constituent elements are laminated above a first oxide film and a nitride film so as to cover an opening which is formed in the nitride film and exposes a second foundation portion above which the nitride film is laminated.

摘要翻译： MEMS器件是具有MEMS振动器的MEMS器件，MEMS振子包括层叠并形成在层叠在晶片衬底的主表面上的第一基底部分之上的多个MEMS构成元件，并且MEMS构成元件层叠在第一氧化物 膜和氮化物膜，以覆盖形成在氮化物膜中的开口，并暴露第二基底部分，在该第二基底部分上层叠氮化物膜。