公开(公告)号：US09950922B2

公开(公告)日：2018-04-24

申请号：US15127237

申请日：2015-03-17

Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Inventor： Yogesh Gianchandani ,  Tao Li ,  Yushu Ma

IPC: B81B7/00 ,  B81B7/02 ,  B81C3/00 ,  H01L23/043 ,  H01L23/053

CPC classification number: B81B7/0048 ,  B81B7/0032 ,  B81B7/0045 ,  B81B7/02 ,  B81B2201/0264 ,  B81C3/00 ,  B81C3/002 ,  B81C3/004 ,  H01L23/043 ,  H01L23/053

Abstract: A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps.