公开(公告)号：US20160012932A1

公开(公告)日：2016-01-14

申请号：US14329616

申请日：2014-07-11

Applicant: Tyco Electronics Corporation

Inventor： Aaron Holm ,  Dominique Freckmann ,  Jennifer L. Robison ,  Mark F. Wartenberg ,  Jialing Wang ,  Josh H. Golden ,  Ting Gao

IPC: H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K7/00 ,  C08K7/06 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/014 ,  C08K2201/016

Abstract: A composite formulation and electrical component are disclosed. The composite formulation includes a polymer matrix having at least 15% crystallinity and process-aid-treated copper-containing particles blended with the polymer matrix including higher aspect ratio particles and lower aspect ratio particles. The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particle and the second particles. The electrical component includes a composite product produced from the composite formulation and is selected from the group consisting of an antenna, electromagnetic interference shielding device, a connector housing, and combinations thereof.

Abstract translation: 公开了一种复合制剂和电子组件。 复合制剂包括具有至少15％结晶度的聚合物基质和与聚合物基质混合的加工助剂处理的含铜颗粒，包括较高纵横比的颗粒和较低纵横比的颗粒。 当通过挤出或模塑处理时，较高比例的颗粒和较低比例的颗粒对复合制剂产生降低的渗透阈值，将减少的渗透阈值与不包括第一颗粒和第二颗粒的​​类似组合物进行比较。 电气部件包括由复合制剂制成的复合材料，并选自天线，电磁干扰屏蔽装置，连接器壳体及其组合。