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    Article with Composite Shield and Process of Producing an Article with a Composite Shield
    1.
    发明申请
    Article with Composite Shield and Process of Producing an Article with a Composite Shield 审中-公开
    具有复合盾牌的文章和制作具有复合盾牌的物品的过程

    公开(公告)号：US20160300638A1

    公开(公告)日：2016-10-13

    申请号：US14684266

    申请日：2015-04-10

    申请人： Tyco Electronics Corporation ,  Tyco Electronics UK Ltd.

    发明人： Jialing Wang ,  Erling Hansen ,  Mark F. Wartenberg ,  Jennifer L. Robison ,  Sreeni Kurup ,  Richard B. Lloyd ,  Ting Gao

    IPC分类号： H01B1/24 ,  H01B1/22 ,  H05K9/00 ,  B29C47/00 ,  B29C47/06

    CPC分类号： H01B1/24 ,  B29C48/022 ,  B29C48/10 ,  B29C48/21 ,  B29K2105/0023 ,  B29K2995/0005 ,  B29L2031/3462 ,  H01B1/22 ,  H05K9/0098

    摘要： An article and process are described. The article includes a conductive heat-recoverable composite shield or a conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield. The conductive composite shield and/or the conductive heat-recovered composite shield formed from a conductive heat-recoverable composite shield comprises a non-conductive matrix and conductive particles within the non-conductive matrix. The article has a resistivity of less than 0.05 ohm·cm. A process of producing the conductive heat-recovered composite shield includes extruding the conductive heat-recoverable composite shield and heating the conductive heat-recoverable composite shield thereby forming the conductive heat-recovered composite shield.

    摘要翻译： 描述了一个文章和过程。 该物品包括由导热性可回收复合护罩形成的导热性可回收复合屏蔽层或导电性热回收复合屏蔽层。 导电复合屏蔽层和/或由导电热恢复复合屏蔽层形成的导电热回收复合屏蔽包括非导电基体和非导电基体内的导电颗粒。 该物品的电阻率小于0.05欧姆·厘米。 导电性热回收复合屏蔽体的制造方法包括：挤出导电性可热成膜复合屏蔽体，对导热性复合屏蔽层进行加热，形成导电性热回收复合屏蔽体。

    Composite Formulation and Electronic Component
    2.
    发明申请
    Composite Formulation and Electronic Component 审中-公开
    复合制剂和电子元件

    公开(公告)号：US20160012932A1

    公开(公告)日：2016-01-14

    申请号：US14329616

    申请日：2014-07-11

    申请人： Tyco Electronics Corporation

    发明人： Aaron Holm ,  Dominique Freckmann ,  Jennifer L. Robison ,  Mark F. Wartenberg ,  Jialing Wang ,  Josh H. Golden ,  Ting Gao

    IPC分类号： H01B1/22

    CPC分类号： H01B1/22 ,  C08K3/08 ,  C08K7/00 ,  C08K7/06 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/014 ,  C08K2201/016

    摘要： A composite formulation and electrical component are disclosed. The composite formulation includes a polymer matrix having at least 15% crystallinity and process-aid-treated copper-containing particles blended with the polymer matrix including higher aspect ratio particles and lower aspect ratio particles. The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particle and the second particles. The electrical component includes a composite product produced from the composite formulation and is selected from the group consisting of an antenna, electromagnetic interference shielding device, a connector housing, and combinations thereof.

    摘要翻译： 公开了一种复合制剂和电子组件。 复合制剂包括具有至少15％结晶度的聚合物基质和与聚合物基质混合的加工助剂处理的含铜颗粒，包括较高纵横比的颗粒和较低纵横比的颗粒。 当通过挤出或模塑处理时，较高比例的颗粒和较低比例的颗粒对复合制剂产生降低的渗透阈值，将减少的渗透阈值与不包括第一颗粒和第二颗粒的​​类似组合物进行比较。 电气部件包括由复合制剂制成的复合材料，并选自天线，电磁干扰屏蔽装置，连接器壳体及其组合。