公开(公告)号：US09129895B2

公开(公告)日：2015-09-08

申请号：US14049464

申请日：2013-10-09

Applicant: Taiwan Semiconductor Manufacturing Co., LTD.

Inventor： Su-Hao Liu ,  Chien-Hung Lin ,  Wei-Han Huang ,  Zi-Wei Fang

IPC: G08B17/00 ,  H01L21/66

CPC classification number: H01L22/26 ,  H01L21/67248 ,  H01L21/67288 ,  H01L22/12

Abstract: The disclosure provides a real-time wafer breakage detection method. The detection method includes the following operations. A wafer is positioned on a wafer holder of a process chamber in which a thermal process is being performed. Then, the temperature at the wafer holder is measured. And, a notification for corrective action is issued if the temperature is out of a predetermined alarm range.

Abstract translation: 本公开提供了一种实时晶片断裂检测方法。 检测方法包括以下操作。 晶片位于正在进行热处理的处理室的晶片保持器上。 然后，测量晶片架上的温度。 并且，如果温度超出预定的报警范围，则发出纠正措施的通知。