公开(公告)号：US20220359252A1

公开(公告)日：2022-11-10

申请号：US17871984

申请日：2022-07-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tzu-Chi CHIU ,  Jen-Ti WANG ,  Ting-Wei WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/67 ,  G05B15/02

Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.

公开(公告)号：US20220328330A1

公开(公告)日：2022-10-13

申请号：US17842340

申请日：2022-06-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chi-Yuan CHU ,  Jen-Ti WANG ,  Wei-Chih CHEN ,  Kuo-Fong CHUANG ,  Cheng-Ho HUNG

IPC: H01L21/67 ,  H01L21/677

Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

公开(公告)号：US20210082736A1

公开(公告)日：2021-03-18

申请号：US17099734

申请日：2020-11-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Fu-Hsien LI ,  Chi-Feng TUNG ,  Chi Yuan CHU ,  Jen-Ti WANG ,  Hsiang Yin SHEN

IPC: H01L21/683 ,  H01L21/67 ,  B65B69/00

Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.

公开(公告)号：US20200176294A1

公开(公告)日：2020-06-04

申请号：US16683998

申请日：2019-11-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Wei-Chih CHEN ,  Shi-Chi CHEN ,  Ting-Wei WANG ,  Jen-Ti WANG ,  Kuo-Fong CHUANG

IPC: H01L21/677 ,  H01L21/67

Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.

公开(公告)号：US20200105557A1

公开(公告)日：2020-04-02

申请号：US16217907

申请日：2018-12-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chao-Hsiung YEH ,  Hsuan CHANG ,  Jen-Ti WANG ,  Chin-Tsan CHEN ,  Kuo-Fong CHUANG

IPC: H01L21/67 ,  G01B11/16

Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.