公开(公告)号：US20240085621A1

公开(公告)日：2024-03-14

申请号：US18151033

申请日：2023-01-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsing-Kuo Hsia ,  Chen-Hua Yu ,  Chih-Wei Tseng ,  Jui Lin Chao

IPC: G02B6/12 ,  G02B6/13

CPC classification number: G02B6/12004 ,  G02B6/13 ,  G02B2006/12121

Abstract: A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.

公开(公告)号：US20230384543A1

公开(公告)日：2023-11-30

申请号：US17896249

申请日：2022-08-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Chen-Hua Yu ,  Jui Lin Chao

IPC: G02B6/42

CPC classification number: G02B6/4271 ,  G02B6/4245 ,  G02B6/4206

Abstract: A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.