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    Optical Module
    1.
    发明公开
    Optical Module 审中-公开

    公开(公告)号：US20240275115A1

    公开(公告)日：2024-08-15

    申请号：US18642723

    申请日：2024-04-22

    申请人： HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

    发明人： Dan LI ,  Mengbo FU ,  Qinhao FU ,  Yifan XIE ,  Tengfei WANG

    IPC分类号： H01S3/04 ,  G02B6/42 ,  H04B10/50

    CPC分类号： H01S3/0405 ,  G02B6/4206 ,  G02B6/4271 ,  G02B6/428 ,  H04B10/503

    摘要： An optical module includes a circuit board and an optical transmitter device. The optical transmitter device includes a substrate, a spacer disposed on and electrically connected to the circuit board, a laser chip disposed on and electrically connected to the spacer, an optical fiber adapter disposed on the substrate in a light exit direction of the laser chip, a focusing lens disposed between the laser chip and the optical fiber adapter, light incident surface of the optical fiber adapter has a first inclination angle with respect to an axis of the optical fiber adapter, the axis of the optical fiber adapter being located in a plane parallel to the substrate, the optical fiber adapter is obliquely disposed on the substrate such that an axis of the internal optical fiber has a second inclination angle with respect to optical axis of the focusing lens.

    IMPROVED PHOTONIC PACKAGING
    2.
    发明公开
    IMPROVED PHOTONIC PACKAGING 审中-公开

    公开(公告)号：US20240184067A1

    公开(公告)日：2024-06-06

    申请号：US18556117

    申请日：2022-04-29

    申请人： Sentea NV

    发明人： Ronny BOCKSTAELE ,  Karsten VERHAEGEN ,  Thijs SPUESENS

    IPC分类号： G02B6/42

    CPC分类号： G02B6/428 ,  G02B6/424 ,  G02B6/4271 ,  G02B6/4272

    摘要： Provided herein is an optoelectronic device having a printed circuit board (PCB) with a planar PCB surface; a photonic integrated circuit (PIC) with a fiber attach region for attachment to a fiber array (FA) and an electronic interface for connecting to the PCB. The PIC is mounted on a portion of the PCB surface being an integral part of the PCB surface. The PCB has an opening preferably circumferentially surrounded by portions of the PCB and dividing the PCB surface in a first and second region for thermally insulating the first region and the second region from one another. The portion of the PCB surface on which the PIC is mounted belongs to the first region, and the connecting of the electronic interface to the PCB relates to at least one wire bond extending to the second region, preferably in the optoelectronic device.

    PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
    4.
    发明公开
    PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER 审中-公开

    公开(公告)号：US20230400649A1

    公开(公告)日：2023-12-14

    申请号：US17835990

    申请日：2022-06-09

    申请人： Unimicron Technology Corp.

    发明人： John Hon-Shing Lau ,  Tzyy-Jang Tseng

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4274 ,  G02B6/4295 ,  H01S5/423 ,  G02B6/4249 ,  G02B6/4271

    摘要： A package structure includes a circuit board, a package substrate, a fine metal L/S RDL-substrate, an electronic assembly, a photonic assembly, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on and electrically connected to the circuit board. The fine metal L/S RDL-substrate is disposed on and electrically connected to the package substrate. The electronic assembly includes an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly which are respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate. The heat dissipation assembly is disposed on the electronic assembly. The optical fiber assembly is disposed on the package substrate and electrically connected to the package substrate and the PIC assembly. A packaging method of the VCSEL array chip is presented.