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公开(公告)号：US20240272352A1
公开(公告)日：2024-08-15
申请号：US18324576
申请日：2023-05-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chen-Hua Yu , Tsung-Fu Tsai , Chih-Hao Yu , Jui Lin Chao , Szu-Wei Lu
CPC classification number: G02B6/12004 , G02B6/136 , G02B2006/12121
Abstract: A method includes connecting a first photonic package to a substrate, wherein the first photonic package includes a first waveguide and a first support over the first waveguide; connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package includes a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 μm to 190 μm; depositing a first quantity of an optical adhesive into the gap; and curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive.
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公开(公告)号：US20240113056A1
公开(公告)日：2024-04-04
申请号：US18178229
申请日：2023-03-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chen-Hua Yu , Chih-Wei Tseng , Jui Lin Chao
IPC: H01L23/00 , G02B6/12 , G02B6/13 , H01L23/498 , H10B80/00
CPC classification number: H01L24/08 , G02B6/12004 , G02B6/13 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/80 , H10B80/00 , G02B2006/12061 , G02B2006/12121 , G02B2006/12123 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/05022 , H01L2224/05124 , H01L2224/05562 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/05666 , H01L2224/05684 , H01L2224/08147 , H01L2224/08237 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/80357 , H01L2224/80379 , H01L2224/80895 , H01L2224/80896 , H01L2924/0504 , H01L2924/0544 , H01L2924/05494 , H01L2924/0665 , H01L2924/07025 , H01L2924/1432 , H01L2924/1433 , H01L2924/14361 , H01L2924/1437
Abstract: A semiconductor package including a first interposer comprising a first substrate, first optical components over the first substrate, a first dielectric layer over the first optical components, and first conductive connectors embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between a second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between a second conductive connector on the photonic package and a first one of the first conductive connectors and a first die bonded to the first side of the first interposer.
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公开(公告)号：US20240107781A1
公开(公告)日：2024-03-28
申请号：US18191213
申请日：2023-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chen-Hua Yu , Jui Lin Chao
IPC: H10B80/00 , H01L23/00 , H01L23/48 , H01S5/02315 , H01S5/0232 , H01S5/02345 , H01S5/028
CPC classification number: H10B80/00 , H01L23/481 , H01L24/48 , H01S5/02315 , H01S5/0232 , H01S5/02345 , H01S5/028 , H01L2224/48225
Abstract: Optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to an optical interposer.
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公开(公告)号：US20240103236A1
公开(公告)日：2024-03-28
申请号：US18149336
申请日：2023-01-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Wei Tseng , Jui Lin Chao , Hsing-Kuo Hsia , Chen-Hua Yu
IPC: G02B6/42
CPC classification number: G02B6/4214 , G02B6/4243
Abstract: A method includes forming an optical engine, which includes a photonic die. The photonic die further includes a grating coupler. The method further includes forming a fiber unit including a fiber platform having a groove, and an optical fiber attached to the fiber platform. The optical fiber extends into the groove. The fiber platform further includes a reflector. The fiber unit is attached to the optical engine, and the reflector is configured to deflect a light beam, so that the light beam emitted by a first one of the optical fiber and the grating coupler is received by a second one of the optical fiber and the grating coupler.
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公开(公告)号：US20250067946A1
公开(公告)日：2025-02-27
申请号：US18455886
申请日：2023-08-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chen-Hua Yu , Hsing-Kuo Hsia , Chih-Wei Tseng , Hua-Kung Chiu , Jui Lin Chao
Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes an optical package having a first surface and a second surface opposite the first surface, a laser die package having a third surface and a fourth surface opposite the third surface, wherein the first surface is planar with the third surface and the second surface is planar with the fourth surface, a first silicon support attached to both the second surface and the fourth surface, and an interposer attached to both the first surface and the third surface, wherein the interposer is free of a silicon substrate.
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Patent Agency Ranking
公开(公告)号：US20250060534A1
公开(公告)日：2025-02-20
申请号：US18451984
申请日：2023-08-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chen-Hua Yu , Chih-Hao Yu , Ren-Fen Tsui , Jui Lin Chao
Abstract: Optical devices and methods of manufacture are presented in which a resonant ring is incorporated with a optical device on an interposer substrate. The material for the resonant ring may be a material that can trigger second order non-linearity in received light or a material that can trigger third order non-linearity without electrical driving mechanisms.
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公开(公告)号：US20240094469A1
公开(公告)日：2024-03-21
申请号：US18151044
申请日：2023-01-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chen-Hua Yu , Jui Lin Chao
CPC classification number: G02B6/132 , G02B6/12004 , G02B6/136 , H01L21/76898 , H01L23/481 , H01L25/167 , G02B2006/12104
Abstract: A method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. The method further includes forming a second dielectric layer to embed the plurality of photonic devices therein, forming an interconnect structure over and signally coupling to the plurality of photonic devices, bonding an electronic die to the interconnect structure, thinning the semiconductor layer, and patterning the semiconductor layer that has been thinned to form openings. The openings are filled with a dielectric material to form dielectric regions. Through-vias are formed to penetrate through the dielectric regions to electrically couple to the interconnect structure.
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公开(公告)号：US20240103218A1
公开(公告)日：2024-03-28
申请号：US18153661
申请日：2023-01-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Jui Lin Chao , Chen-Hua Yu , Chih-Hao Yu , Shih-Peng Tai
CPC classification number: G02B6/122 , G02B6/13 , G02B2006/12121
Abstract: Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.
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公开(公告)号：US20240085621A1
公开(公告)日：2024-03-14
申请号：US18151033
申请日：2023-01-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chen-Hua Yu , Chih-Wei Tseng , Jui Lin Chao
CPC classification number: G02B6/12004 , G02B6/13 , G02B2006/12121
Abstract: A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.
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公开(公告)号：US20230384543A1
公开(公告)日：2023-11-30
申请号：US17896249
申请日：2022-08-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Hsing-Kuo Hsia , Chih-Kuang Yu , Chen-Hua Yu , Jui Lin Chao
IPC: G02B6/42
CPC classification number: G02B6/4271 , G02B6/4245 , G02B6/4206
Abstract: A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.
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