公开(公告)号：US20230384543A1

公开(公告)日：2023-11-30

申请号：US17896249

申请日：2022-08-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Chen-Hua Yu ,  Jui Lin Chao

IPC: G02B6/42

CPC classification number: G02B6/4271 ,  G02B6/4245 ,  G02B6/4206

Abstract: A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.