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公开(公告)号:US20230384543A1
公开(公告)日:2023-11-30
申请号:US17896249
申请日:2022-08-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hsing-Kuo Hsia , Chih-Kuang Yu , Chen-Hua Yu , Jui Lin Chao
IPC: G02B6/42
CPC classification number: G02B6/4271 , G02B6/4245 , G02B6/4206
Abstract: A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.