公开(公告)号：US20100120203A1

公开(公告)日：2010-05-13

申请号：US12693096

申请日：2010-01-25

申请人： Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

发明人： Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

IPC分类号： H01L21/50 ,  H01L21/56

CPC分类号： H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

摘要翻译： 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。

公开(公告)号：US20110101110A1

公开(公告)日：2011-05-05

申请号：US12887000

申请日：2010-09-21

申请人： Taku NISHIYAMA

发明人： Taku NISHIYAMA

IPC分类号： G06K19/077

CPC分类号： G06K19/07732 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to one embodiment, a semiconductor device includes a memory chip and a controller chip. A circuit board includes a first surface on which an array of external connection terminals are provided and an second surface on which the memory and controller chips are provided. An array of connection pads is provided on the second surface and outside the memory chip at an external connection terminal side. An array of resistor devices is provided on the second surface and along the array of connection pads at the opposite side of the memory chip. Plugs outside near-memory-chip ends of the external connection terminals penetrate the first and surfaces. A first wiring passes outside the array of resistor devices and the array of connection pads on the second surface, and connects one resistor device and one plug. A second wiring on the first surface connects one plug and one external connection terminal.

摘要翻译： 根据一个实施例，半导体器件包括存储器芯片和控制器芯片。 电路板包括设置有外部连接端子阵列的第一表面和设置有存储器和控制器芯片的第二表面。 连接焊盘的阵列在外部连接端子侧设置在第二表面和存储芯片外部。 电阻器件阵列设置在第二表面上并沿着存储芯片相对侧的连接焊盘阵列。 外部连接端子的近内存芯片端部外的插头穿透第一和表面。 第一布线通过电阻器件阵列和第二表面上的连接焊盘阵列，并连接一个电阻器件和一个插头。 第一个表面上的第二个接线连接一个插头和一个外部连接端子。

公开(公告)号：US20080048043A1

公开(公告)日：2008-02-28

申请号：US11842619

申请日：2007-08-21

申请人： Taku NISHIYAMA

发明人： Taku NISHIYAMA

IPC分类号： G06K19/06

CPC分类号： G06K19/07743 ,  G06K19/07732

摘要： A semiconductor memory card has a base card having an opening on the top thereof; a semiconductor package that incorporates a semiconductor memory having an input/output terminal that is formed on an upper surface thereof and that is electrically connected to the semiconductor memory and that can be connected to an external device, and being mounted in said base card in such a manner that the input/output terminal is exposed through said opening; and a mask plate that is mounted on the top of a side wall of said base card and covers said semiconductor package in such a manner that at least a part of said input/output terminal is exposed, wherein said base card and said mask plate are made of resin, at least one of said base card and said mask plate has a connecting part made of resin at a site where said base card and said mask plate are in contact with each other.

摘要翻译： 半导体存储卡具有在其顶部具有开口的基卡; 半导体封装，其包括半导体存储器，其具有形成在其上表面上并且与半导体存储器电连接并且可以连接到外部设备的输入/输出端子，并且以这种方式安装在所述基卡中 输入/输出端子通过所述开口暴露的方式; 以及掩模板，其安装在所述基座的侧壁的顶部并且以使得所述输入/输出端子的至少一部分被暴露的方式覆盖所述半导体封装，其中所述基卡和所述掩模板是 所述基板和所述掩模板中的至少一个在所述基板和所述掩模板彼此接触的位置处具有由树脂制成的连接部。