公开(公告)号：US20240215155A1

公开(公告)日：2024-06-27

申请号：US18557020

申请日：2022-01-26

申请人： NITTO DENKO CORPORATION

发明人： Makoto TSUNEKAWA

IPC分类号： H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/10

CPC分类号： H05K1/0296 ,  H05K1/053 ,  H05K3/0044 ,  H05K3/10 ,  H05K2203/0228

摘要： An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.

公开(公告)号：US20240040708A1

公开(公告)日：2024-02-01

申请号：US18257579

申请日：2022-01-19

申请人： FUJIKURA PRINTED CIRCUITS LTD.

发明人： Daisuke Arai ,  Shigeki Otsuka

IPC分类号： H05K3/28 ,  H05K3/30 ,  H05K3/46

CPC分类号： H05K3/288 ,  H05K3/305 ,  H05K3/4632 ,  H05K2203/0228

摘要： A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.

公开(公告)号：US11849544B2

公开(公告)日：2023-12-19

申请号：US16918474

申请日：2020-07-01

申请人： Gentherm Inc.

发明人： Jan Horzella ,  Fritz Jung

IPC分类号： B02C23/00 ,  B02C23/14 ,  B02C23/38 ,  H05K1/02 ,  H05K3/04 ,  H05K3/00

CPC分类号： H05K3/043 ,  B02C23/00 ,  B02C23/14 ,  B02C23/38 ,  H05K1/028 ,  H05K3/0044 ,  H05K2203/0143 ,  H05K2203/0228

摘要： A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

公开(公告)号：US20230380072A1

公开(公告)日：2023-11-23

申请号：US18109334

申请日：2023-02-14

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Yi-Hui Chen ,  Yi-Hua Huang ,  Yen-Ping Huang ,  Shih-Chieh Chang

IPC分类号： H05K3/04

CPC分类号： H05K3/041 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0191 ,  H05K2203/0278

摘要： A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.

公开(公告)号：US11690172B2

公开(公告)日：2023-06-27

申请号：US17681279

申请日：2022-02-25

申请人： Metrospec Technology, L.L.C.

发明人： Henry V. Holec ,  Wm. Todd Crandell

IPC分类号： H05K1/11 ,  H05K1/14 ,  H01R12/00 ,  H05K1/02 ,  H05K3/36 ,  H01R13/717 ,  H01R12/52 ,  H01R4/02 ,  F21Y107/30 ,  F21Y115/10 ,  H05K3/00

CPC分类号： H05K1/0293 ,  H01R4/02 ,  H01R12/00 ,  H01R12/523 ,  H01R13/717 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0292 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/113 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K3/363 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2027 ,  H05K2203/0228

摘要： Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

公开(公告)号：US20190088584A1

公开(公告)日：2019-03-21

申请号：US16131492

申请日：2018-09-14

申请人： LG Display Co., Ltd.

发明人： Jooyeon WON ,  ChangHo AN

IPC分类号： H01L23/498 ,  H01L21/66 ,  H01L21/48 ,  H01L27/12 ,  H01L23/00

CPC分类号： H01L23/49838 ,  G01R31/2818 ,  H01L21/4803 ,  H01L22/22 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/32 ,  H01L27/124 ,  H01L2224/32227 ,  H01L2924/1426 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09127 ,  H05K2201/10128 ,  H05K2203/0228 ,  H05K2203/175

摘要： A driver IC film unit including a flexible film, a driver IC on a first surface of the flexible film and configured to receive an input signal and convert the input signal into an image signal for a display panel, at least first to third pad units, on the first surface of the flexible film, configured to electrically connect the driver IC and the flexible film, and at least first to third wire units, on the first surface of the flexible film, electrically connected to the at least first to third pad units, wherein at least one wire unit among the at least first to third wire units is configured to be extended to a second surface facing the first surface via a first via hole passing through the flexible film, and is configured to include a cut portion of wire corresponding to an edge of the flexible film.

公开(公告)号：US20180295723A1

公开(公告)日：2018-10-11

申请号：US16008060

申请日：2018-06-14

申请人： Unimicron Technology Corp.

发明人： Ming-Hao Wu ,  Wen-Fang Liu

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

摘要： A manufacturing method of a circuit board structure includes the following steps: providing an inner circuit structure which includes a core layer; performing a build-up process to laminate a first build-up circuit structure on a first patterned circuit layer of the inner circuit structure, wherein the first build-up circuit structure includes an inner dielectric layer, and the inner dielectric layer directly covers an upper surface of the core layer and the first patterned circuit layer; removing a portion of the first build-up circuit structure to form an opening extending from a first surface of the first build-up circuit structure relatively far away from the inner circuit structure to a portion of the inner dielectric layer; performing a sandblasting process on a first inner surface of the inner dielectric layer exposed by the opening to at least remove the portion of the inner dielectric layer exposed by the opening.

公开(公告)号：US10070524B2

公开(公告)日：2018-09-04

申请号：US13442092

申请日：2012-04-09

申请人： Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

发明人： Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

IPC分类号： H01R43/00 ,  H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498 ,  H05K3/46 ,  H01L23/15 ,  H05K3/00

CPC分类号： H05K1/112 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/10253 ,  H05K3/0014 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10674 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

摘要： A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

公开(公告)号：US10039184B2

公开(公告)日：2018-07-31

申请号：US15427061

申请日：2017-02-08

申请人： Unimicron Technology Corp.

发明人： Ming-Hao Wu ,  Wen-Fang Liu

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

摘要： A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. The first build-up circuit structure is disposed on the upper surface of the core layer and covers the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface.

公开(公告)号：US09999134B2

公开(公告)日：2018-06-12

申请号：US15081623

申请日：2016-03-25

申请人： Multek Technologies Limited

发明人： Mark Zhang ,  Kwan Pen ,  Pui Yin Yu

IPC分类号： H05K1/03 ,  H05K3/04 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC分类号： H05K3/048 ,  H05K1/036 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K2201/0989 ,  H05K2203/0228 ,  H05K2203/1383

摘要： A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.