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39 条记录 (耗时 0.019 秒)

    WATER INHIBITING SLIDE SWITCH
    11.
    发明申请
    WATER INHIBITING SLIDE SWITCH 失效
    防水滑动开关

    公开(公告)号：US20120055767A1

    公开(公告)日：2012-03-08

    申请号：US12970759

    申请日：2010-12-16

    申请人： Kyle Yeates ,  Teodor Dabov

    发明人： Kyle Yeates ,  Teodor Dabov

    IPC分类号： H01H15/04 ,  H01H3/00

    CPC分类号： H01H15/04

    摘要： Electromechanical switches are provided. The electromechanical switches can include conductive components that are configured to change position relative to one another in response to a mechanical input. The electromechanical switch can include a distribution mechanism for replenishing a moisture inhibiting layer, such as an oleophobic material, on surface portions of conductive components within the switch. During actuation of the electromechanical switch, the distribution mechanism can be configured to reapply the moisture inhibiting material to the surface portions of the conductive components to prevent damage resulting from moisture intrusion.

    摘要翻译： 提供机电开关。 机电开关可以包括被配置为响应于机械输入而相对于彼此改变位置的导电部件。 机电开关可以包括用于在开关内的导电部件的表面部分上补充诸如疏油材料的防潮层的分配机构。 在机电开关的致动期间，分配机构可以被配置为将防潮材料重新应用于导电部件的表面部分，以防止由湿气侵入引起的损坏。

    Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board
    13.
    发明申请
    Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board 有权
    将柔性电路连接到印刷电路板的方法和装置

    公开(公告)号：US20090211789A1

    公开(公告)日：2009-08-27

    申请号：US12234479

    申请日：2008-09-19

    申请人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    发明人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H05K3/323 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T156/10

    摘要： Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译： 公开了使用各向异性导电膜（ACF）接合工艺将柔性电路结合到印刷电路板（PCB）的方法和系统。 根据本发明的一个方面，支撑件可以以电磁干扰（EMI）屏蔽壳体的方式附接，使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位，并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    Can spring housing contact
    16.
    发明授权
    Can spring housing contact 有权
    可弹簧外壳接触

    公开(公告)号：US07638717B1

    公开(公告)日：2009-12-29

    申请号：US12186995

    申请日：2008-08-06

    申请人： Kyle Yeates ,  Scott Myers ,  Teodor Dabov

    发明人： Kyle Yeates ,  Scott Myers ,  Teodor Dabov

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0032

    摘要： An electromagnetic interference (EMI) shield is provided. The EMI shield may include a frame and a cover operative to be placed over the frame. The cover may include snaps or tabs extending from the surface of the cover and operative to engage side walls of the frame. At least one edge of the cover, for example an edge operative to be placed near an electronic device housing, may not include snaps or tabs to reduce the size of the EMI shield near the housing. Instead, the frame may include one or more stepped returns, the top-most of which may be operative to be placed in contact with the cover. The cover may include a spring, an emboss and one or more grounding points to ensure that the cover remains in contact with the frame despite the absence of snaps or tabs securing the cover to the frame.

    摘要翻译： 提供电磁干扰（EMI）屏蔽。 EMI屏蔽可以包括框架和可操作地放置在框架上的盖子。 盖可以包括从盖的表面延伸并且可操作以接合框架的侧壁的卡扣或突片。 盖的至少一个边缘，例如可操作地放置在电子设备外壳附近的边缘，可以不包括用于减小壳体附近的EMI屏蔽的尺寸的卡扣或突片。 相反，框架可以包括一个或多个阶梯式返回，其中最顶层的操作可以被放置成与盖接触。 盖可以包括弹簧，浮雕和一个或多个接地点，以确保盖子保持与框架接触，尽管没有将盖子固定到框架上。

    Electromagnetic interference shields with piezos
    17.
    发明授权
    Electromagnetic interference shields with piezos 有权
    带电压的电磁干扰屏蔽

    公开(公告)号：US08126170B2

    公开(公告)日：2012-02-28

    申请号：US12236452

    申请日：2008-09-23

    申请人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    发明人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    IPC分类号： H04R25/00

    CPC分类号： H04R17/00 ,  H04R17/10 ,  H04R2499/11 ,  Y10T29/53174

    摘要： Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

    摘要翻译： 公开了用于提高与诸如压电扬声器的扬声器相关联的声学性能的方法和装置。 根据一个方面，一种装置包括基板，安装在基板上的壳体和压电扬声器装置。 压电扬声器装置至少部分地安装在罐上。 在一个实施例中，衬底是印刷电路板（PCB），并且罐是电磁干扰（EMI）屏蔽罐。

    Method for attaching a flex circuit to a printed circuit board
    19.
    发明授权
    Method for attaching a flex circuit to a printed circuit board 有权
    将柔性电路连接到印刷电路板的方法

    公开(公告)号：US09125331B2

    公开(公告)日：2015-09-01

    申请号：US13598362

    申请日：2012-08-29

    申请人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    发明人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    IPC分类号： H05K3/30 ,  H05K3/32 ,  H05K3/36

    CPC分类号： H05K3/323 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T156/10

    摘要： Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译： 公开了使用各向异性导电膜（ACF）接合工艺将柔性电路结合到印刷电路板（PCB）的方法和系统。 根据本发明的一个方面，支撑件可以以电磁干扰（EMI）屏蔽壳体的方式附接，使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位，并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    Water inhibiting slide switch
    20.
    发明授权
    Water inhibiting slide switch 失效
    防水滑动开关

    公开(公告)号：US08440922B2

    公开(公告)日：2013-05-14

    申请号：US12970759

    申请日：2010-12-16

    申请人： Kyle Yeates ,  Teodor Dabov

    发明人： Kyle Yeates ,  Teodor Dabov

    IPC分类号： H01H13/00

    CPC分类号： H01H15/04

    摘要： Electromechanical switches are provided. The electromechanical switches can include conductive components that are configured to change position relative to one another in response to a mechanical input. The electromechanical switch can include a distribution mechanism for replenishing a moisture inhibiting layer, such as an oleophobic material, on surface portions of conductive components within the switch. During actuation of the electromechanical switch, the distribution mechanism can be configured to reapply the moisture inhibiting material to the surface portions of the conductive components to prevent damage resulting from moisture intrusion.

    摘要翻译： 提供机电开关。 机电开关可以包括被配置为响应于机械输入而相对于彼此改变位置的导电部件。 机电开关可以包括用于在开关内的导电部件的表面部分上补充诸如疏油材料的防潮层的分配机构。 在机电开关的致动期间，分配机构可以被配置为将防潮材料重新应用于导电部件的表面部分，以防止由湿气侵入引起的损坏。