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    Electromagnetic interference shields with piezos
    1.
    发明授权
    Electromagnetic interference shields with piezos 有权
    带电压的电磁干扰屏蔽

    公开(公告)号：US08457333B2

    公开(公告)日：2013-06-04

    申请号：US13401729

    申请日：2012-02-21

    申请人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    发明人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    IPC分类号： H04R25/00

    CPC分类号： H04R17/00 ,  H04R17/10 ,  H04R2499/11 ,  Y10T29/53174

    摘要： Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

    摘要翻译： 公开了用于提高与诸如压电扬声器的扬声器相关联的声学性能的方法和装置。 根据一个方面，一种装置包括基板，安装在基板上的壳体和压电扬声器装置。 压电扬声器装置至少部分地安装在罐上。 在一个实施例中，衬底是印刷电路板（PCB），并且罐是电磁干扰（EMI）屏蔽罐。

    Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board
    3.
    发明申请
    Method and Apparatus for Attaching a Flex Circuit to a Printed Circuit Board 有权
    将柔性电路连接到印刷电路板的方法和装置

    公开(公告)号：US20090211789A1

    公开(公告)日：2009-08-27

    申请号：US12234479

    申请日：2008-09-19

    申请人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    发明人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H05K3/323 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T156/10

    摘要： Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译： 公开了使用各向异性导电膜（ACF）接合工艺将柔性电路结合到印刷电路板（PCB）的方法和系统。 根据本发明的一个方面，支撑件可以以电磁干扰（EMI）屏蔽壳体的方式附接，使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位，并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    Electromagnetic interference shields with piezos
    6.
    发明授权
    Electromagnetic interference shields with piezos 有权
    带电压的电磁干扰屏蔽

    公开(公告)号：US08126170B2

    公开(公告)日：2012-02-28

    申请号：US12236452

    申请日：2008-09-23

    申请人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    发明人： Kyle Yeates ,  Stephen Brian Lynch ,  Teodor Dabov

    IPC分类号： H04R25/00

    CPC分类号： H04R17/00 ,  H04R17/10 ,  H04R2499/11 ,  Y10T29/53174

    摘要： Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

    摘要翻译： 公开了用于提高与诸如压电扬声器的扬声器相关联的声学性能的方法和装置。 根据一个方面，一种装置包括基板，安装在基板上的壳体和压电扬声器装置。 压电扬声器装置至少部分地安装在罐上。 在一个实施例中，衬底是印刷电路板（PCB），并且罐是电磁干扰（EMI）屏蔽罐。

    Method for attaching a flex circuit to a printed circuit board
    8.
    发明授权
    Method for attaching a flex circuit to a printed circuit board 有权
    将柔性电路连接到印刷电路板的方法

    公开(公告)号：US09125331B2

    公开(公告)日：2015-09-01

    申请号：US13598362

    申请日：2012-08-29

    申请人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    发明人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    IPC分类号： H05K3/30 ,  H05K3/32 ,  H05K3/36

    CPC分类号： H05K3/323 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T156/10

    摘要： Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译： 公开了使用各向异性导电膜（ACF）接合工艺将柔性电路结合到印刷电路板（PCB）的方法和系统。 根据本发明的一个方面，支撑件可以以电磁干扰（EMI）屏蔽壳体的方式附接，使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位，并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    METHOD FOR ATTACHING A FLEX CIRCUIT TO A PRINTED CIRCUIT BOARD
    9.
    发明申请
    METHOD FOR ATTACHING A FLEX CIRCUIT TO A PRINTED CIRCUIT BOARD 审中-公开
    用于将柔性电路连接到印刷电路板的方法

    公开(公告)号：US20130042955A1

    公开(公告)日：2013-02-21

    申请号：US13598362

    申请日：2012-08-29

    申请人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    发明人： Kyle Yeates ,  Teodor Dabov ,  Stephen Brian Lynch

    IPC分类号： B32B37/12

    CPC分类号： H05K3/323 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T156/10

    摘要： Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译： 公开了使用各向异性导电膜（ACF）接合工艺将柔性电路结合到印刷电路板（PCB）的方法和系统。 根据本发明的一个方面，支撑件可以以电磁干扰（EMI）屏蔽壳体的方式附接，使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位，并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。