Process for treating hard tissues
    12.
    发明授权
    Process for treating hard tissues 有权
    硬组织治疗方法

    公开(公告)号:US6159012A

    公开(公告)日:2000-12-12

    申请号:US387449

    申请日:1999-09-01

    CPC分类号: A61K6/0023 Y10S522/908

    摘要: In a first aspect, a method for treating hard tissue that includes: (a) applying to hard tissue a composition that includes a cationically active functional group, a free radically active functional group, and a polymerization initiator capable of initiating free radical polymerization, where the number of moles of cationically active functional groups per gram of composition is no greater than about 0.0075; and (b) exposing the composition to polymerization conditions to form an adhesive bonded to the hard tissue.In a second aspect, a method for treating hard tissue that includes: (a) applying to hard tissue a first polymerizable composition that includes a free radically active functional group and a polymerization initiator capable of initiating free radical polymerization, but is essentially free of polymerizable components having cationically active functional groups and is capable of forming an adhesive bonded to the hard tissue upon exposure to polymerization conditions; (b) applying a second polymerizable composition; and (c) exposing the second composition to polymerization conditions to form a hardened composition adhered to the hard tissue. The second composition includes (i) a cationically active functional group and (ii) an polymerization initiator capable of initiating cationic polymerization.

    摘要翻译: 第一方面,一种硬组织处理方法,包括:(a)向硬组织施加包含阳离子活性官能团,自由基活性官能团和能引发自由基聚合的聚合引发剂的组合物,其中 每克组合物中阳离子活性官能团的摩尔数不大于约0.0075; 和(b)将组合物暴露于聚合条件以形成粘合到硬组织的粘合剂。 在第二方面,一种硬组织处理方法,包括:(a)向硬组织施加包含自由基活性官能团的第一可聚合组合物和能引发自由基聚合的聚合引发剂,但基本上不含可聚合的 具有阳离子活性官能团的组分并且能够在暴露于聚合条件时形成粘合到硬组织的粘合剂; (b)施加第二可聚合组合物; 和(c)将第二组合物暴露于聚合条件以形成粘附到硬组织的硬化组合物。 第二组合物包括(i)阳离子活性官能团和(ii)能够引发阳离子聚合的聚合引发剂。

    Packaging curable materials
    18.
    发明授权
    Packaging curable materials 失效
    包装可固化材料

    公开(公告)号:US5172809A

    公开(公告)日:1992-12-22

    申请号:US615790

    申请日:1990-11-20

    IPC分类号: A61C7/00 A61C7/12 A61C19/02

    摘要: Disclosed is a packaged element containing a) a substrate that transmits less than about 0.5% of actinic radiation and has at least one recess, b) a cover that transmits less than about 0.5% of actinic radiation and transmits at least part of the visible light spectrum, c) a structure for maintaining the cover in contact with the substrate such that the cover filters incident radiation entering the recess, and d) an element located in the recess and having a substance thereon that is curable by exposure to the actinic radiation. Also disclosed is an article containing a) a substrate having at least one recess with an interior surface, b) an element having a tacky substance on a surface thereof, and c) a structure for positioning the element inside the recess such that the tacky substance does not separate from the element upon removal from the recess.

    Packaging curable materials
    19.
    发明授权
    Packaging curable materials 失效
    包装可固化材料

    公开(公告)号:US4978007A

    公开(公告)日:1990-12-18

    申请号:US350609

    申请日:1989-05-10

    IPC分类号: A61C7/00 A61C7/12 A61C19/02

    摘要: Disclosed is a packaged element containing (a) a substrate that transmits less than about 0.5% of actinic radiation and has at least one recess, (b) a cover that transmits less than about 0.5% of actinic radiation and transmits at least part of the visible light spectrum, (c) a structure for maintaining the cover in contact with the substrate such that the cover filters incident radiation entering the recess, and (d) an element located in the recess and having a substance thereon that is curable by exposure to the actinic radiation. Also disclosed is an article containing (a) a substrate having at least one recess with an interior surface, (b) an element having a tacky substance on a surface thereof, and (c) a structure for positioning the element inside the recess such that the tacky substance does not separate from the element upon removal from the recess.

    摘要翻译: 公开了一种封装元件,其包含(a)透射小于约0.5%的光化辐射并具有至少一个凹部的基底,(b)透射小于约0.5%的光化辐射的盖,并且透射至少一部分 可见光光谱,(c)用于保持盖与基板接触的结构,使得盖过滤进入凹部的入射辐射,以及(d)位于凹部中的元件,并且其上具有可通过暴露于 光化辐射。 还公开了一种制品,其包含(a)具有至少一个具有内表面的凹部的基底,(b)在其表面上具有粘性物质的元件,和(c)用于将所述元件定位在所述凹部内的结构,使得 该粘性物质在从凹部移除时不与元件分离。