公开(公告)号：US20190047118A1

公开(公告)日：2019-02-14

申请号：US16059344

申请日：2018-08-09

Applicant: Tokyo Electron Limited

Inventor： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

IPC: B24B53/017 ,  B24B37/20 ,  B24B37/04

Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.