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    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
    2.
    发明公开
    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 审中-公开

    公开(公告)号：US20230381825A1

    公开(公告)日：2023-11-30

    申请号：US18322855

    申请日：2023-05-24

    Applicant: Tokyo Electron Limited

    Inventor： Yoshiki Okamoto ,  Akihiro Kubo ,  Yasushi Takiguchi

    IPC: B08B1/00 ,  B08B3/02 ,  B08B1/02

    CPC classification number: B08B1/001 ,  B08B3/022 ,  B08B1/02 ,  H01L21/67051

    Abstract: A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.

    Substrate processing apparatus
    4.
    发明授权
    Substrate processing apparatus 有权

    公开(公告)号：US11532487B2

    公开(公告)日：2022-12-20

    申请号：US16872441

    申请日：2020-05-12

    Applicant: Tokyo Electron Limited

    Inventor： Akihiro Kubo ,  Yasushi Takiguchi ,  Teruhiko Kodama ,  Yoshiki Okamoto ,  Hayato Hosaka

    IPC: H01L21/461 ,  H01L21/67 ,  B24B37/04 ,  H01L21/306

    Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

    Developing treatment apparatus and developing treatment method
    5.
    发明授权
    Developing treatment apparatus and developing treatment method 有权
    开发治疗仪器和开发治疗方法

    公开(公告)号：US09470979B2

    公开(公告)日：2016-10-18

    申请号：US15051780

    申请日：2016-02-24

    Applicant: Tokyo Electron Limited

    Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Yoshinori Ikeda ,  Koki Yoshimura ,  Yoshiki Okamoto ,  Masahiro Fukuda

    IPC: G03B27/32 ,  G03C5/26 ,  G03F7/16

    CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

    Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

    Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

    DRESSING APPARATUS AND DRESSING METHOD FOR SUBSTRATE REAR SURFACE POLISHING MEMBER
    8.
    发明申请
    DRESSING APPARATUS AND DRESSING METHOD FOR SUBSTRATE REAR SURFACE POLISHING MEMBER 审中-公开

    公开(公告)号：US20190047118A1

    公开(公告)日：2019-02-14

    申请号：US16059344

    申请日：2018-08-09

    Applicant: Tokyo Electron Limited

    Inventor： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

    IPC: B24B53/017 ,  B24B37/20 ,  B24B37/04

    Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

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