公开(公告)号：US20230381825A1

公开(公告)日：2023-11-30

申请号：US18322855

申请日：2023-05-24

Applicant: Tokyo Electron Limited

Inventor： Yoshiki Okamoto ,  Akihiro Kubo ,  Yasushi Takiguchi

IPC: B08B1/00 ,  B08B3/02 ,  B08B1/02

CPC classification number: B08B1/001 ,  B08B3/022 ,  B08B1/02 ,  H01L21/67051

Abstract: A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.

公开(公告)号：US11139182B2

公开(公告)日：2021-10-05

申请号：US16214501

申请日：2018-12-10

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  B08B1/04 ,  B08B1/00 ,  H01L21/304 ,  H01L21/677 ,  B24B37/30 ,  B24B37/10

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US09947556B2

公开(公告)日：2018-04-17

申请号：US14321054

申请日：2014-07-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Hideharu Kyouda ,  Koshi Muta

IPC: B08B1/04 ,  B08B3/04 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/67046 ,  H01L21/68792

Abstract: There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

公开(公告)号：US11887869B2

公开(公告)日：2024-01-30

申请号：US17467346

申请日：2021-09-06

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/06 ,  H01L21/687 ,  B24B37/30 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67046 ,  B08B1/001 ,  B08B1/04 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/68728 ,  H01L21/68742

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US10289004B2

公开(公告)日：2019-05-14

申请号：US15338638

申请日：2016-10-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi

IPC: G03F7/30 ,  B05D3/12 ,  B05C11/08 ,  B05D1/00 ,  H01L21/67 ,  B05C5/02 ,  B05D1/26

Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

公开(公告)号：US20190049845A1

公开(公告)日：2019-02-14

申请号：US16100609

申请日：2018-08-10

Applicant: Tokyo Electron Limited

Inventor： Koki Yoshimura ,  Shogo Takahasi ,  Yasushi Takiguchi ,  Taro Yamamoto

IPC: G03F7/16

Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

公开(公告)号：US10014190B2

公开(公告)日：2018-07-03

申请号：US14339539

申请日：2014-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Koki Yoshimura ,  Taro Yamamoto ,  Hideharu Kyouda ,  Koshi Muta

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/6715

Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

公开(公告)号：US09716002B2

公开(公告)日：2017-07-25

申请号：US15204068

申请日：2016-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Akihiro Fujimoto ,  Shuuichi Nishikido ,  Dai Kumagai ,  Naoto Yoshitaka ,  Takahiro Kitano ,  Yoichi Tokunaga

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  B08B5/02 ,  B08B7/00 ,  H01L21/687

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

公开(公告)号：US09568829B2

公开(公告)日：2017-02-14

申请号：US14449419

申请日：2014-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi ,  Masahiro Fukuda

IPC: B05D3/12 ,  G03F7/30 ,  B05C5/02 ,  B05D1/00 ,  B05C11/08 ,  B05D1/26 ,  H01L21/67

CPC classification number: G03F7/3021 ,  B05C5/02 ,  B05C5/027 ,  B05C11/08 ,  B05D1/005 ,  B05D1/26 ,  G03F7/30 ,  H01L21/6715

Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.

Abstract translation: 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。

公开(公告)号：US20240213046A1

公开(公告)日：2024-06-27

申请号：US18419867

申请日：2024-01-23

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  B08B1/10 ,  B08B1/32 ,  B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67046 ,  B08B1/10 ,  B08B1/32 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/68728 ,  H01L21/68742

Abstract: A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.