公开(公告)号：US20190272977A1

公开(公告)日：2019-09-05

申请号：US16296827

申请日：2019-03-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Michishige SAITO

IPC: H01J37/32 ,  C23C4/11 ,  C23C4/04 ,  C23C4/12

Abstract: In an exemplary embodiment, an upper electrode is disposed in a processing chamber to face a susceptor and provided with a plate-like member and an electrode part. In an exemplary embodiment, the plate-like member is formed with a gas distribution hole that distributes a processing gas used for a plasma processing. The electrode part is formed in a film shape by thermally spraying silicon onto a surface of the plate-like member where an outlet of the gas distribution hole is formed.

公开(公告)号：US20150129112A1

公开(公告)日：2015-05-14

申请号：US14528001

申请日：2014-10-30

Applicant: Tokyo Electron Limited

Inventor： Michishige SAITO ,  Koichi MURAKAMI ,  Takashi YAMAMOTO

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32522 ,  H01J37/32532 ,  H01J37/32541 ,  H01J37/3255

Abstract: A shower head assembly includes an electrode plate, and a laminate base that is constituted of ceramic sheets and provided to hold the electrode plate. The laminate base includes no bonding surface between the ceramic sheets. The laminate base includes a first gas diffusion space formed in its central area and a second gas diffusion space formed in its peripheral area. A first heater electrode layer is provided above the first gas diffusion space, and a second heater electrode layer is provided above the second gas diffusion space. A first coolant passage is formed above the first gas diffusion space, and a second coolant passage is formed above the second gas diffusion space. A first gas supply passage is connected to the first gas diffusion space, and a second gas supply passage is connected to the second gas diffusion space.

Abstract translation: 淋浴头组件包括电极板和由陶瓷片构成并设置成夹持电极板的层叠基座。 层压基底不包括陶瓷片之间的粘合表面。 层叠基部包括在其中心区域形成的第一气体扩散空间和形成在其周边区域中的第二气体扩散空间。 第一加热电极层设置在第一气体扩散空间的上方，第二加热电极层设置在第二气体扩散空间的上方。 第一冷却剂通道形成在第一气体扩散空间上方，第二冷却剂通道形成在第二气体扩散空间的上方。 第一气体供给通路与第一气体扩散空间连接，第二气体供给路与第二气体扩散空间连接。