Abstract:
A plasma processing apparatus includes a chamber body that provides a chamber, a support structure which supports a workpiece inside the chamber body, and a first drive device which rotates the support structure inside the chamber body about a first axis that extends in a direction orthogonal to the vertical direction. The support structure includes a holding unit including an electrostatic chuck which holds the workpiece and which is rotatable around a second axis orthogonal to the first axis, a container provided below the holding unit, and a second drive device which rotates the holding unit around the second axis. The container has a cylindrical container body and a bottom cover configured to close a bottom side opening in the container body. The bottom cover is detachable from the container body.
Abstract:
An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a thickness gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove.
Abstract:
A plasma processing apparatus includes a support structure configured to support a workpiece and a first drive device configured to rotate the support structure about a first axis extending in a direction orthogonal to a vertical direction. The support structure includes a holding unit including an electrostatic chuck and a container provided under the holding unit. The container includes a tubular container body, and a bottom cover configured to close a bottom side opening of the container body and to be detachable from the container body. A maintenance method includes: rotating a support structure about a first axis such that the bottom cover is positioned above an electrostatic chuck, removing the bottom cover from the container body, and maintaining a component provided in the container body.
Abstract:
Disclosed is a slip ring including: a conductive rotor that is rotatable around a rotation axis; a conductive stator provided coaxially with the rotor; a conductive sphere disposed between the rotor and the stator to form an electric path between the rotor and the stator; and a conductive coil spring provided between the sphere and one of the rotor and the stator and extending in a circumferential direction with respect to the rotation axis to be in contact with the sphere and one of the rotor and the stator.
Abstract:
A method of manufacturing a semiconductor device is provided by performing plasma processing on a substrate to be processed by using a plasma processing apparatus including a processing chamber, a lower electrode, an upper electrode, a plurality of lifter pins, a focus ring, a lifter pin for focus ring and an electrical connection mechanism.
Abstract:
A shower head assembly includes an electrode plate, and a laminate base that is constituted of ceramic sheets and provided to hold the electrode plate. The laminate base includes no bonding surface between the ceramic sheets. The laminate base includes a first gas diffusion space formed in its central area and a second gas diffusion space formed in its peripheral area. A first heater electrode layer is provided above the first gas diffusion space, and a second heater electrode layer is provided above the second gas diffusion space. A first coolant passage is formed above the first gas diffusion space, and a second coolant passage is formed above the second gas diffusion space. A first gas supply passage is connected to the first gas diffusion space, and a second gas supply passage is connected to the second gas diffusion space.
Abstract:
Disclosed is a test apparatus for efficiently and accurately testing a high frequency voltage dependency of an impedance of a test object without damaging the test object. The test apparatus includes a high frequency power source unit, a reference waveform generator, a matching device, an oscilloscope, a control panel, and a main control unit. The test apparatus may boost a high frequency pulse output at a relatively low power from the high frequency power source unit to a voltage required for a high frequency withstand voltage test to be applied to a test object in a state where impedance matching is performed between the high frequency power source unit and the test by the matching device, that is, under a tuned state. Whether the waveform of the voltage applied to the test object is a defined waveform may be concisely monitored and observed by the oscilloscope.