公开(公告)号：US20190273063A1

公开(公告)日：2019-09-05

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/68 ,  H01L21/67 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.