公开(公告)号：US11094667B2

公开(公告)日：2021-08-17

申请号：US16347856

申请日：2017-10-10

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US09741595B2

公开(公告)日：2017-08-22

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Sugakawa ,  Yuji Mimura ,  Shuhei Matsumoto ,  Takahiro Masunaga ,  Makoto Tsukishima

IPC: H01L21/67 ,  H01L21/66 ,  H01L23/00 ,  H01L21/68 ,  H01L21/822

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

公开(公告)号：US20210343678A1

公开(公告)日：2021-11-04

申请号：US17374156

申请日：2021-07-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US20190273063A1

公开(公告)日：2019-09-05

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/68 ,  H01L21/67 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20230026661A1

公开(公告)日：2023-01-26

申请号：US17936068

申请日：2022-09-28

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20130334172A1

公开(公告)日：2013-12-19

申请号：US13677534

申请日：2012-11-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。

公开(公告)号：US11658146B2

公开(公告)日：2023-05-23

申请号：US17374156

申请日：2021-07-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  B23K20/00 ,  H01L21/02 ,  H01L21/67207 ,  H01L21/68 ,  H01L21/683 ,  H01L24/94 ,  H01L2224/759 ,  H01L2224/75744 ,  H01L2224/75802

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US11488929B2

公开(公告)日：2022-11-01

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L21/68 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20190312006A1

公开(公告)日：2019-10-10

申请号：US16347856

申请日：2017-10-10

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US09039863B2

公开(公告)日：2015-05-26

申请号：US13677534

申请日：2012-11-15

Applicant: Tokyo Electron Limited

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: C23F1/00 ,  H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。