公开(公告)号：US20220093482A1

公开(公告)日：2022-03-24

申请号：US17480090

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.

公开(公告)号：US20250120204A1

公开(公告)日：2025-04-10

申请号：US18981677

申请日：2024-12-16

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H10F39/00 ,  H10F39/95

Abstract: Multi-chip image sensor semiconductor packages and methods for forming such packages are disclosed. A multi-chip package includes at least one cover covering a sensor die. Some multi-chip packages include multiple covers for covering each sensor die. In one multi-chip packages, a single cover covers multiple sensor chips.

公开(公告)号：US20240339484A1

公开(公告)日：2024-10-10

申请号：US18747638

申请日：2024-06-19

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL Kwon Shim ,  Jeffrey Punzalan

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L27/14685 ,  H01L23/315 ,  H01L24/29 ,  H01L27/14625 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/48225

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

公开(公告)号：US12100719B2

公开(公告)日：2024-09-24

申请号：US17352348

申请日：2021-06-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant by a cover adhesive. The protective cover is supported by a lower portion of step shaped inner encapsulant sidewalls.

公开(公告)号：US20210193483A1

公开(公告)日：2021-06-24

申请号：US17125995

申请日：2020-12-17

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL Kwon Shim ,  Jeffrey Punzalan

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

公开(公告)号：US12166050B2

公开(公告)日：2024-12-10

申请号：US17478978

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  Il Kwon Shim

IPC: H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.