Wafer carrier with a 31-pocket configuration

    公开(公告)号:USD793972S1

    公开(公告)日:2017-08-08

    申请号:US29522214

    申请日:2015-03-27

    CPC classification number: H01L21/68771 C23C16/4584 H01L21/68764

    Abstract: A wafer carrier including thirty-one pockets arranged on a top surface, configured to be used with a chemical vapor deposition, is provided. The wafer carrier comprises: a body having a top surface and a bottom surface arranged opposite one another, and a plurality of pockets defined in the top surface of the wafer carrier, wherein the plurality of pockets consist of a total 31 pockets, each of the pockets is arranged along one of 3 circles, and the 3 circles are concentric with one another and with a circular outline formed by a perimeter of the top surface.

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