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公开(公告)号:US20140266824A1
公开(公告)日:2014-09-18
申请号:US13843909
申请日:2013-03-15
Applicant: XILINX, INC.
Inventor: Donnacha Lowney , Christophe Erdmann , Edward Cullen
IPC: H03M1/10
CPC classification number: H03M1/1009 , H03M1/742
Abstract: An apparatus for calibration of a signal converter is disclosed. This apparatus includes a first digital-to-analog converter (“DAC”) and a calibration system coupled to an output port of the first DAC. The calibration system includes a second DAC. The calibration system is configured to provide an adjustment signal responsive to a spurious spectral performance parameter in an output of the first DAC. The spurious spectral performance parameter is sensitive to a timing error associated with the first DAC. The calibration system is coupled to provide the adjustment signal to the first DAC to correct the timing error of the first DAC.
Abstract translation: 公开了一种用于校准信号转换器的装置。 该装置包括第一数模转换器(“DAC”)和耦合到第一DAC的输出端口的校准系统。 校准系统包括第二DAC。 校准系统被配置为响应于第一DAC的输出中的寄生光谱性能参数提供调整信号。 寄生光谱性能参数对与第一个DAC相关的定时误差敏感。 校准系统被耦合以向第一DAC提供调整信号以校正第一DAC的定时误差。
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公开(公告)号:US20140253171A1
公开(公告)日:2014-09-11
申请号:US13789347
申请日:2013-03-07
Applicant: XILINX, INC.
Inventor: Donnacha Lowney , Marites De La Torre
IPC: G01R31/28
CPC classification number: G01R31/2896 , G01R31/31855 , H01L22/34 , H01L23/49816 , H01L23/49838 , H01L23/58 , H01L25/0657 , H01L2224/16225 , H01L2924/15192 , H01L2924/15311
Abstract: An apparatus with package integrity monitoring capability, includes: a package having a die connected to an interposer through a plurality of bumps, wherein at least some of the bumps comprise dummy bumps; a package integrity monitor having a transmitter to transmit a test signal and a receiver to receive the test signal; and a first scan chain comprising a plurality of alternating interconnects in the die and in the interposer connecting some of the dummy bumps in series, wherein the first scan chain has a first end coupled to the transmitter of the package integrity monitor and a second end coupled to the receiver of the package integrity monitor.
Abstract translation: 一种具有封装完整性监测功能的装置,包括:具有通过多个凸块连接到插入件的管芯的封装,其中至少一些凸块包括虚拟凸块; 包装完整性监视器,具有发送测试信号的发射机和用于接收测试信号的接收机; 以及第一扫描链,其包括在所述管芯中的所述多个交替互连件和在所述插入器中串联连接所述虚设凸起的第一扫描链,其中所述第一扫描链具有耦合到所述封装完整性监视器的所述发射器的第一端, 到包装完整性监视器的接收器。
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