公开(公告)号：US20150145615A1

公开(公告)日：2015-05-28

申请号：US14092241

申请日：2013-11-27

Applicant: Xilinx, Inc.

Inventor： Jing Jing ,  Shuxian Wu ,  Zhaoyin D. Wu

IPC: H03H7/01 ,  H03H3/00

CPC classification number: H03H7/0115 ,  H01L23/5223 ,  H01L23/5227 ,  H01L27/016 ,  H01L28/10 ,  H01L28/60 ,  H01L28/88 ,  H01L2924/0002 ,  H03H5/02 ,  H03H7/0138 ,  H05K1/16 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A circuit includes a first finger capacitor having a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements. The first bus line is parallel to the second bus line. The circuit further includes an inductor having a first leg oriented perpendicular to the first bus line and the second bus line. The first leg of the inductor is coupled to a center of the first bus line.

Abstract translation: 电路包括具有耦合到第一多个指状元件的第一总线和耦合到第二多个指状元件的第二总线的第一指状电容器。 第一条总线与第二条总线平行。 电路还包括具有垂直于第一总线线路和第二总线线路定向的第一支路的电感器。 电感器的第一段耦合到第一总线的中心。

公开(公告)号：US08860180B2

公开(公告)日：2014-10-14

申请号：US13661195

申请日：2012-10-26

Applicant: Xilinx, Inc.

Inventor： Jing Jing ,  Shuxian Wu ,  Parag Upadhyaya

IPC: H01F5/04

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductor structure implemented within a semiconductor integrated circuit includes a coil of conductive material including at least one turn and a current return encompassing the coil. The current return is formed of a plurality of interconnected metal layers of the semiconductor integrated circuit.

Abstract translation: 在半导体集成电路内实现的电感器结构包括包括至少一个匝的导电材料的线圈和包围线圈的电流返回。 电流返回由半导体集成电路的多个互连的金属层形成。